SNVSBF7 November   2019 LDC1001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Axial Distance Sensing Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Condition
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring RP With LDC1001
      3. 7.3.3 Measuring Inductance With LDC1001
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB Pin Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDY Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Maps
      1. 7.6.1 Register Description
        1. 7.6.1.1  Revision ID (Address = 0x00)
        2. 7.6.1.2  RP_MAX (Address = 0x01)
        3. 7.6.1.3  RP_MIN (Address = 0x02)
        4. 7.6.1.4  Watchdog Timer Frequency (Address = 0x03)
        5. 7.6.1.5  LDC Configuration (Address = 0x04)
        6. 7.6.1.6  Clock Configuration (Address = 0x05)
        7. 7.6.1.7  Comparator Threshold High LSB (Address = 0x06)
        8. 7.6.1.8  Comparator Threshold High MSB (Address = 0x07)
        9. 7.6.1.9  Comparator Threshold Low LSB (Address = 0x08)
        10. 7.6.1.10 Comparator Threshold Low MSB (Address = 0x09)
        11. 7.6.1.11 INTB Pin Configuration (Address = 0x0A)
        12. 7.6.1.12 Power Configuration (Address = 0x0B)
        13. 7.6.1.13 Status (Address = 0x20)
        14. 7.6.1.14 Proximity Data LSB (Address = 0x21)
        15. 7.6.1.15 Proximity Data MSB (Address = 0x22)
        16. 7.6.1.16 Frequency Counter LSB (Address = 0x23)
        17. 7.6.1.17 Frequency Counter Mid-Byte (Address = 0x24)
        18. 7.6.1.18 Frequency Counter MSB (Address = 0x25)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of RP_MIN and RP_MAX
        1. 8.1.1.1 RP_MAX
        2. 8.1.1.2 RP_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Pins)
    2. 8.2 Typical Application
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor With LDC1001
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting RP_MIN and RP_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

NHR Package
16-Pin WSON
Top View
LDC1001 conndiag_LDC1001.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NO. NAME
1 SCLK DI SPI clock input. SCLK is used to clock-out/clock-in the data from/into the chip.
2 CSB DI SPI CSB. Multiple devices can be connected on the same SPI bus with each device having a dedicated CSB connection to the MCU so that each device can be uniquely selected.
3 SDI DI SPI Slave Data In (Master Out Slave In). This should be connected to the Master Out Slave In of the master.
4 VIO P Digital IO Supply
6 DGND P Digital ground
5 SDO DO SPI Slave Data Out (Master In Slave Out). This pin is high-Z when CSB is high.
7 CFB A LDC filter capacitor
8 CFA A LDC filter capacitor
9 INA A External LC Tank. Connected to external LC tank
10 INB A External LC Tank. Connected to external LC tank
11 GND P Analog ground
12 VDD P Analog supply
13 CLDO A LDO bypass capacitor. A 56-nF capacitor should be connected from this pin to GND.
14 TBCLK DI/A External time-base clock
15 NC NC This pin should be left floating.
16 INTB DO Configurable interrupt output.
— DAP P Connect to GND for improved thermal performance.(2)
(1) DO: Digital Output, DI: Digital Input, P: Power, A: Analog
(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP can be left floating, for best performance the DAP should be connected to the same potential as the devices's GND pin. Do no use the DAP as the primary ground for the device. The device GND pin must always be connected to ground.