SNOSCY0 March   2014 LDC1051

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductive Sensing
      2. 7.3.2 Measuring Rp with LDC1051
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
      2. 7.4.2 INTB terminal Modes
        1. 7.4.2.1 Comparator Mode
        2. 7.4.2.2 Wake-Up Mode
        3. 7.4.2.3 DRDYB Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Description
        1. 7.5.1.1 Extended SPI Transactions
    6. 7.6 Register Map and Description
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Calculation of Rp_MIN and Rp_MAX
        1. 8.1.1.1 Setting Rp_MAX
        2. 8.1.1.2 Setting Rp_MIN
      2. 8.1.2 Output Data Rate
      3. 8.1.3 Choosing Filter Capacitor (CFA and CFB Terminals)
    2. 8.2 Typical Applications
      1. 8.2.1 Axial Distance Sensing Using a PCB Sensor with LDC1051
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sensor and Target
          2. 8.2.1.2.2 Calculating Sensor Capacitor
          3. 8.2.1.2.3 Choosing Filter Capacitor
          4. 8.2.1.2.4 Setting Rp_MIN and Rp_MAX
          5. 8.2.1.2.5 Calculating Minimum Sensor Frequency
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Lateral Position Sensing Application Diagram
      3. 8.2.3 Angular Position Sensing Application Diagram
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Terminal Configuration and Functions

WSON-16
Top View
conndiag_snoscy0.gif

Terminal Functions

TERMINAL NAME TERMINAL NO.
 TERMINAL TYPE
 DESCRIPTION
SCLK 1 DO SPI clock input. SCLK is used to clock-out/clock-in the data from/into the chip
CSB 2 DI SPI CSB(Chip Select Bar). Multiple devices can be connected on the same SPI bus and CSB can be used to select the device to be communicated with
SDI 3 DI SPI Slave Data In (Master Out Slave In). This should be connected to the Master Out Slave In of the master
VIO 4 P Digital IO Supply
SDO 5 DO SPI Slave Data Out (Master In Slave Out).It is high impedance when CSB is high
DGND 6 P Digital ground
CFB 7 A LDC filter capacitor
CFA 8 A LDC filter capacitor
INA 9 A External LC Tank. Connect to external LC tank
INB 10 A External LC Tank. Connect to external LC tank
GND 11 P Analog ground
VDD 12 P Analog supply
CLDO 13 A LDO bypass capacitor. A 56nF capacitor should be connected from this Terminal to GND
N/C 14 N/C No Connection
N/C 15 N/C No Connection
INTB 16 DO Configurable interrupt. This Terminal can be configured to behave in 3 different ways by programing the INT Terminal mode register. Either threshold detect, wakeup, or DRDYB
DAP 17 P Connect to GND