SNOSD15B December   2016  – April 2017 LDC2112 , LDC2114

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Digital Interface
    7. 6.7 I2C Interface
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Multi-Channel and Single-Channel Operation
      2. 7.3.2 Button Output Interfaces
      3. 7.3.3 Programmable Button Sensitivity
      4. 7.3.4 Baseline Tracking
      5. 7.3.5 Integrated Button Algorithms
      6. 7.3.6 I2C Interface
        1. 7.3.6.1 Selectable I2C Address (LDC2112 Only)
        2. 7.3.6.2 I2C Interface Specifications
        3. 7.3.6.3 I2C Bus Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Power Mode
      2. 7.4.2 Low Power Mode
      3. 7.4.3 Configuration Mode
    5. 7.5 Register Maps
      1. 7.5.1 Individual Register Listings
        1. 7.5.1.1 Gain Table for Registers GAIN0, GAIN1, GAIN2, and GAIN3
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Theory of Operation
      2. 8.1.2  Designing Sensor Parameters
      3. 8.1.3  Setting COM Pin Capacitor
      4. 8.1.4  Defining Power-On Timing
      5. 8.1.5  Configuring Button Scan Rate
      6. 8.1.6  Programming Button Sampling Window
      7. 8.1.7  Scaling Frequency Counter Output
      8. 8.1.8  Setting Button Triggering Threshold
      9. 8.1.9  Tracking Baseline
      10. 8.1.10 Mitigating False Button Detections
        1. 8.1.10.1 Eliminating Common-Mode Change (Anti-Common)
        2. 8.1.10.2 Resolving Simultaneous Button Presses (Max-Win)
        3. 8.1.10.3 Overcoming Case Twisting (Anti-Twist)
        4. 8.1.10.4 Mitigating Metal Deformation (Anti-Deform)
      11. 8.1.11 Reporting Interrupts for Button Presses and Error Conditions
      12. 8.1.12 Estimating Supply Current
    2. 8.2 Typical Application
      1. 8.2.1 Touch Button Design
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 DSBGA Light Sensitivity
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Export Control Notice
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now.

Table 44. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LDC2112 Click here Click here Click here Click here Click here
LDC2114 Click here Click here Click here Click here Click here

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

11.8 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.