SLCS005AF october   1979  – august 2023 LM193 , LM2903 , LM2903B , LM2903V , LM293 , LM293A , LM393 , LM393A , LM393B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information: LM193
    4. 6.4  Thermal Information: LM293, LM393, LM2903 (all 'V' and 'A' suffixes)
    5. 6.5  Thermal Information: LM393B and LM2903B
    6. 6.6  ESD Ratings
    7. 6.7  Electrical Characteristics LM393B
    8. 6.8  Electrical Characteristics LM2903B
    9. 6.9  Switching Characteristics LM393B and LM2903B
    10. 6.10 Electrical Characteristics for LM193, LM293, and LM393 (without A suffix)
    11. 6.11 Electrical Characteristics for LM293A and LM393A
    12. 6.12 Electrical Characteristics for LM2903, LM2903V, and LM2903AV
    13. 6.13 Switching Characteristics: LM193, LM239, LM393, LM2903, all 'A' and 'V' versions
    14. 6.14 Typical Characteristics, LMx93, LM2903 (all 'V' and 'A' suffixes)
    15. 6.15 Typical Characteristics, LM393B and LM2903B
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 Minimum Overdrive Voltage
        3. 8.2.2.3 Output and Drive Current
        4. 8.2.2.4 Response Time
      3. 8.2.3 Application Curves
      4. 8.2.4 Power Supply Recommendations
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
        2. 8.2.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information: LM393B and LM2903B

THERMAL METRIC(1)LM393B, LM2903BUNIT
D
(SOIC)		PW
(TSSOP)		DGK
(VSSOP)		DDF
(SOT-23)		DSG
(WSON)
8 pin8 pin8 pin8 pin8 pins
RθJAJunction-to-ambient thermal resistance 148.5200.6193.7 197.996.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance 90.289.682.9119.2119.0°C/W
RθJBJunction-to-board thermal resistance 91.8131.3 115.5115.463.1°C/W
ψJTJunction-to-top characterization parameter 38.522.1 20.819.412.4°C/W
ψJBJunction-to-board characterization parameter 91.1129.6 113.9113.763.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance----37.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.