SNVSBV5B December   2020  – December 2021 LM25149

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 ACTIVE EMI  Filter
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN)
      2. 8.3.2  High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA)
      3. 8.3.3  Precision Enable (EN)
      4. 8.3.4  Power-Good Monitor (PG)
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Active EMI Filter
      7. 8.3.7  Dual Random Spread Spectrum (DRSS)
      8. 8.3.8  Soft Start
      9. 8.3.9  Output Voltage Setpoint (FB)
      10. 8.3.10 Minimum Controllable On Time
      11. 8.3.11 Error Amplifier and PWM Comparator (FB, EXTCOMP)
      12. 8.3.12 Slope Compensation
      13. 8.3.13 Inductor Current Sense (ISNS+, VOUT)
        1. 8.3.13.1 Shunt Current Sensing
        2. 8.3.13.2 Inductor DCR Current Sensing
      14. 8.3.14 Hiccup Mode Current Limiting
      15. 8.3.15 High-Side and Low-Side Gate Drivers (HO, LO)
      16. 8.3.16 Output Configurations (CNFG)
      17. 8.3.17 Single-Output Dual-Phase Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Pulse Frequency Modulation and Synchronization (PFM/SYNC)
      3. 8.4.3 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Power Train Components
        1. 9.1.1.1 Buck Inductor
        2. 9.1.1.2 Output Capacitors
        3. 9.1.1.3 Input Capacitors
        4. 9.1.1.4 Power MOSFETs
        5. 9.1.1.5 EMI Filter
        6. 9.1.1.6 Active EMI Filter
      2. 9.1.2 Error Amplifier and Compensation
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High Efficiency 2.1-MHz Synchronous Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2  Custom Design With Excel Quickstart Tool
          3. 9.2.1.2.3  Buck Inductor
          4. 9.2.1.2.4  Current-Sense Resistance
          5. 9.2.1.2.5  Output Capacitors
          6. 9.2.1.2.6  Input Capacitors
          7. 9.2.1.2.7  Frequency Set Resistor
          8. 9.2.1.2.8  Feedback Resistors
          9. 9.2.1.2.9  Compensation Components
          10. 9.2.1.2.10 Active EMI Components
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – High Efficiency 440-kHz Synchronous Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Design 3 – Dual-Phase 400-kHz 20-A Synchronous Buck Regulator
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Stage Layout
      2. 11.1.2 Gate-Drive Layout
      3. 11.1.3 PWM Controller Layout
      4. 11.1.4 Active EMI Layout
      5. 11.1.5 Thermal Design and Layout
      6. 11.1.6 Ground Plane Design
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
      2. 12.1.2 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
        1. 12.2.1.1 PCB Layout Resources
        2. 12.2.1.2 Thermal Design Resources
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7 Dual Random Spread Spectrum (DRSS)

The LM25149 provides a digital spread spectrum, which reduces the EMI of the power supply over a wide frequency range. DRSS combines a low-frequency triangular modulation profile with a high frequency cycle-by-cycle random modulation profile. The low-frequency triangular modulation improves performance in lower radio-frequency bands, while the high-frequency random modulation improves performance in higher radio frequency bands.

Spread spectrum works by converting a narrowband signal into a wideband signal that spreads the energy over multiple frequencies. Since industry standards require different EMI receiver resolution bandwidth (RBW) settings for different frequency bands, the RBW has an impact on the spread spectrum performance. DRSS is able to simultaneously improve the EMI performance in the low and high RBWs with its low-frequency triangular modulation profile and high frequency cycle-by-cycle random modulation, respectively. DRSS can reduce conducted emissions by 15 dBμV in the CISPR 25 low-frequency band (150 kHz to 30 MHz) and 5 dBμV in the high-frequency band (30 MHz to 108 MHz).

To enable DRSS, connect either a 41.2-kΩ or 71.5-kΩ resistor from CNFG to AGND. DRSS is disabled when an external clock is applied to the PFM/SYNC pin.

GUID-20210617-CA0I-DRPQ-N4VH-VHJFZDN4WXQ8-low.gif Figure 8-3 Dual Random Spread Spectrum Implementation