SNVS487E December   2006  – January 2015 LM27313 , LM27313-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM27313
    3. 6.3 ESD Ratings: LM27313-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application Circuit VIN=5.0 V, VOUT=12.0 V, Iload=250 mA
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Selecting the External Capacitors
          2. 8.2.1.2.2  Selecting the Output Capacitor
          3. 8.2.1.2.3  Selecting the Input Capacitor
          4. 8.2.1.2.4  Feed-Forward Compensation
          5. 8.2.1.2.5  Selecting Diodes
          6. 8.2.1.2.6  Setting the Output Voltage
          7. 8.2.1.2.7  Duty Cycle
          8. 8.2.1.2.8  Inductance Value
          9. 8.2.1.2.9  Maximum Switch Current
          10. 8.2.1.2.10 Calculating Load Current
          11. 8.2.1.2.11 Design Parameters VSW and ISW
          12. 8.2.1.2.12 Minimum Inductance
          13. 8.2.1.2.13 Inductor Suppliers
          14. 8.2.1.2.14 Shutdown Pin Operation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application Circuit VIN=5.0V, VOUT=20.0V, Iload=150mA
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT
FB Pin Voltage −0.4 6 V
SW Pin Voltage −0.4 30 V
Input Supply Voltage −0.4 14.5 V
Shutdown Input Voltage (Survival) −0.4 14.5 V
Lead Temp. (Soldering, 5 s) 300 °C
Power Dissipation Internally Limited
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.2 ESD Ratings: LM27313

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM27313-Q1

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
Charged device model (CDM), per AEC Q100-011 Corner pins (1, 3, 4, and 5) ±1000
Other pins ±1000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN 2.7 14 V
VSW(MAX) 30 V
VSHDN 0 VIN V
Junction Temperature, TJ –40 125 °C

6.5 Thermal Information

THERMAL METRIC(1) LM27313, LM27313-Q1 UNIT
DBV
5 PINS
RθJA Junction-to-ambient thermal resistance 166.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71.8
RθJB Junction-to-board thermal resistance 28.1
ψJT Junction-to-top characterization parameter 2.1
ψJB Junction-to-board characterization parameter 27.7
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.6 Electrical Characteristics

Unless otherwise specified: VIN = 5 V, VSHDN = 5 V, IL = 0 mA, and TJ = 25°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input Voltage −40°C ≤ TJ ≤ +125°C 2.7 14 V
ISW Switch Current Limit See(1) 0.80 1.25 A
RDS(ON) Switch ON Resistance ISW = 100 mA 500 650 mΩ
VSHDN(TH) Shutdown Threshold Device ON, −40°C ≤ TJ ≤ +125°C 1.5 V
Device OFF, −40°C ≤ TJ ≤ +125°C 0.50
ISHDN Shutdown Pin Bias Current VSHDN = 0 0 µA
VSHDN = 5 V 0 2
VSHDN = 5 V, −40°C ≤ TJ ≤ +125°C
VFB Feedback Pin Reference Voltage VIN = 3 V 1.230 V
VIN = 3 V, −40°C ≤ TJ ≤ +125°C 1.205 1.255
IFB Feedback Pin Bias Current VFB = 1.23 V 60 nA
IQ Quiescent Current VSHDN = 5 V, Switching 2.1 mA
VSHDN = 5 V, Switching, −40°C ≤ TJ ≤ +125°C 3.0
VSHDN = 5 V, Not Switching 400 µA
VSHDN = 5 V, Not Switching, −40°C ≤ TJ ≤ +125°C 500
VSHDN = 0 0.024 1
ΔVFB/ΔVIN FB Voltage Line Regulation 2.7 V ≤ VIN ≤ 14 V 0.02 %/V
fSW Switching Frequency 1.6 MHz
−40°C ≤ TJ ≤ +125°C 1.15 1.90
DMAX Maximum Duty Cycle 88%
−40°C ≤ TJ ≤ +125°C 80%
IL Switch Leakage Not Switching, VSW = 5 V 1 µA
(1) Switch current limit is dependent on duty cycle. Limits shown are for duty cycles ≤ 50%. See Figure 15.

6.7 Typical Characteristics

Unless otherwise specified: VIN = 5 V, SHDN pin is tied to VIN, TJ = 25°C.
20216810.png
Figure 1. Iq VIN (Active) vs Temperature
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Figure 3. Max. Duty Cycle vs Temperature
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Figure 5. RDS(ON) vs Temperature
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Figure 7. RDS(ON) vs VIN
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Figure 9. Efficiency vs Load Current (VOUT = 15 V)
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Figure 11. Efficiency vs Load Current (VOUT = 25 V)
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Figure 2. Oscillator Frequency vs Temperature
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Figure 4. Feedback Voltage vs Temperature
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Figure 6. Current Limit vs Temperature
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Figure 8. Efficiency vs Load Current (VOUT = 12 V)
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Figure 10. Efficiency vs Load Current (VOUT = 20 V)