SNVS334F January   2005  – January 2016 LM2734Z , LM2734Z-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Theory of Operation
      2. 7.3.2 Boost Function
      3. 7.3.3 Soft-Start
      4. 7.3.4 Output Overvoltage Protection
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
      2. 7.4.2 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM2734Z Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Inductor Selection
          2. 8.2.1.2.2  Input Capacitor
          3. 8.2.1.2.3  Output Capacitor
          4. 8.2.1.2.4  Catch Diode
          5. 8.2.1.2.5  Boost Diode
          6. 8.2.1.2.6  Boost Capacitor
          7. 8.2.1.2.7  Output Voltage
          8. 8.2.1.2.8  Calculating Efficiency, and Junction Temperature
          9. 8.2.1.2.9  Calculating the LM2734Z Junction Temperature
          10. 8.2.1.2.10 WSON Package
          11. 8.2.1.2.11 Package Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 LM2734Z Design Example 2
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 LM2734Z Design Example 3
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 LM2734Z Design Example 4
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
      5. 8.2.5 LM2734Z Design Example 5
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.