SLCS141L may   2003  – august 2023 LM2903-Q1 , LM2903B-Q1

PRODUCTION DATA  

  1.   1
  2.   Features
  3.   Applications
  4.   Description
  5. 1Revision History
  6. 2Pin Configuration and Functions
    1. 2.1 Pin Functions
  7. 3Specifications
    1. 3.1  Absolute Maximum Ratings, LM2903-Q1 and LM2903E-Q1
    2. 3.2  Absolute Maximum Ratings, LM2903B-Q1
    3. 3.3  ESD Ratings, LM2903-Q1 and LM2903E-Q1
    4. 3.4  ESD Ratings, LM2903B-Q1
    5. 3.5  Recommended Operating Conditions, LM2903B-Q1
    6. 3.6  Recommended Operating Conditions, LM2903-Q1
    7. 3.7  Recommended Operating Conditions, LM2903E-Q1
    8. 3.8  Thermal Information, LM2903-Q1 and LM2903E-Q1
    9. 3.9  Thermal Information, LM2903B-Q1
    10. 3.10 Electrical Characteristics LM2903B - Q1
    11. 3.11 Switching Characteristics LM2903B - Q1
    12. 3.12 LM2903B-Q1 "T", "R" and "H" Temperature Test Options
    13. 3.13 Electrical Characteristics, LM2903-Q1 and LM2903E-Q1
    14. 3.14 Switching Characteristics, LM2903-Q1 and LM2903E-Q1
    15. 3.15 Typical Characteristics, LM2903-Q1 and LM2903E-Q1 Only
    16. 3.16 Typical Characteristics, LM2903B-Q1 Only
  8. 4Detailed Description
    1. 4.1 Overview
    2. 4.2 Functional Block Diagram
    3. 4.3 Feature Description
    4. 4.4 Device Functional Modes
      1. 4.4.1 Voltage Comparison
  9. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Typical Application
      1. 5.2.1 Design Requirements
      2. 5.2.2 Detailed Design Procedure
        1. 5.2.2.1 Input Voltage Range
        2. 5.2.2.2 Minimum Overdrive Voltage
        3. 5.2.2.3 Output and Drive Current
        4. 5.2.2.4 Response Time
      3. 5.2.3 Application Curves
    3. 5.3 Power Supply Recommendations
    4. 5.4 Layout
      1. 5.4.1 Layout Guidelines
      2. 5.4.2 Layout Example
  10. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  11. 7Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • DDF|8
  • PW|8
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.