SLCS141M May   2003  – December 2024 LM2903-Q1 , LM2903B-Q1

PRODUCTION DATA  

  1.   1
  2.   Features
  3.   Applications
  4.   Description
  5. 1Pin Configuration and Functions
    1. 1.1 Pin Functions
  6. 2Specifications
    1. 2.1  Absolute Maximum Ratings, LM2903-Q1 and LM2903E-Q1
    2. 2.2  Absolute Maximum Ratings, LM2903B-Q1
    3. 2.3  ESD Ratings, LM2903-Q1 and LM2903E-Q1
    4. 2.4  ESD Ratings, LM2903B-Q1
    5. 2.5  Recommended Operating Conditions, LM2903B-Q1
    6. 2.6  Recommended Operating Conditions, LM2903-Q1
    7. 2.7  Recommended Operating Conditions, LM2903E-Q1
    8. 2.8  Thermal Information
    9. 2.9  Electrical Characteristics LM2903B - Q1
    10. 2.10 Switching Characteristics LM2903B - Q1
    11. 2.11 LM2903B-Q1 "T", "R" and "H" Temperature Test Options
    12. 2.12 Electrical Characteristics, LM2903-Q1 and LM2903E-Q1
    13. 2.13 Switching Characteristics, LM2903-Q1 and LM2903E-Q1
    14. 2.14 Typical Characteristics
  7. 3Detailed Description
    1. 3.1 Overview
    2. 3.2 Functional Block Diagram
    3. 3.3 Feature Description
    4. 3.4 Device Functional Modes
      1. 3.4.1 Voltage Comparison
  8. 4Application and Implementation
    1. 4.1 Application Information
    2. 4.2 Typical Application
      1. 4.2.1 Design Requirements
      2. 4.2.2 Detailed Design Procedure
        1. 4.2.2.1 Input Voltage Range
        2. 4.2.2.2 Minimum Overdrive Voltage
        3. 4.2.2.3 Output and Drive Current
        4. 4.2.2.4 Response Time
      3. 4.2.3 Application Curves
    3. 4.3 Power Supply Recommendations
    4. 4.4 Layout
      1. 4.4.1 Layout Guidelines
      2. 4.4.2 Layout Example
  9. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 Related Documentation
    2. 5.2 Receiving Notification of Documentation Updates
    3. 5.3 Support Resources
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 Glossary
  10. 6Revision History
  11. 7Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • DDF|8
  • PW|8
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2.8 Thermal Information

THERMAL METRIC(1)LM2903x-Q1UNIT
D
(SOIC)		DGK
(VSSOP)		PW
(TSSOP)		DSG
(WSON)		DDF
(SOT-23)
8 PINS8 PINS8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance

154.1

176.5

182.9

102.1

197.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance

96.5

85.5

87.1

126.0

119.2
RθJBJunction-to-board thermal resistance

97.7

112.4

123.2

68.6

115.4
ψJTJunction-to-top characterization parameter

45.7

17.3

16.7

15.9

19.4
ψJBJunction-to-board characterization parameter

96.9

110.1

120.4

68.4

113.7
RθJC(bot)Junction-to-case (bottom) thermal resistance---

43.9

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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.