SNVS465G October   2006  – September 2015 LM3404 , LM3404HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Controlled On-Time Overview
      2. 7.3.2 Average LED Current Accuracy
      3. 7.3.3 Maximum Output Voltage
      4. 7.3.4 Minimum Output Voltage
      5. 7.3.5 High Voltage Bias Regulator
      6. 7.3.6 Internal MOSFET and Driver
      7. 7.3.7 Fast Shutdown for PWM Dimming
      8. 7.3.8 Peak Current Limit
      9. 7.3.9 Overvoltage and Overcurrent Comparator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Power Shutdown
      2. 7.4.2 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Switching Frequency
      2. 8.1.2 LED Ripple Current
      3. 8.1.3 Buck Converters Without Output Capacitors
      4. 8.1.4 Buck Converters With Output Capacitors
      5. 8.1.5 Input Capacitors
      6. 8.1.6 Recirculating Diode
      7. 8.1.7 LED Current During DIM Mode
      8. 8.1.8 Transient Protection Considerations
        1. 8.1.8.1 CS Pin Protection
        2. 8.1.8.2 CS Pin Protection With OVP
        3. 8.1.8.3 VIN Pin Protection
        4. 8.1.8.4 General Comments Regarding Other Pins
    2. 8.2 Typical Applications
      1. 8.2.1 Design Example 1: LM3404
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 RON and tON
          2. 8.2.1.2.2 Output Inductor
          3. 8.2.1.2.3 Using an Output Capacitor
          4. 8.2.1.2.4 RSNS
          5. 8.2.1.2.5 Input Capacitor
          6. 8.2.1.2.6 Recirculating Diode
          7. 8.2.1.2.7 CB and CF
          8. 8.2.1.2.8 Efficiency
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design Example 2: LM3404HV
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 RON and tON
          2. 8.2.2.2.2 Output Inductor
          3. 8.2.2.2.3 Using an Output Capacitor
          4. 8.2.2.2.4 RSNS
          5. 8.2.2.2.5 Input Capacitor
          6. 8.2.2.2.6 Recirculating Diode
          7. 8.2.2.2.7 CB and CF
          8. 8.2.2.2.8 Efficiency
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout
      2. 10.1.2 Ground Plane and Shape Routing
      3. 10.1.3 Current Sensing
      4. 10.1.4 Remote LED Arrays
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VIN to GND LM3404 –0.3 45 V
LM3404HV –0.3 76
BOOT to GND LM3404 –0.3 59 V
LM3404HV –0.3 90
SW to GND LM3404 –1.5 45 V
LM3404HV –1.5 76
BOOT to VCC LM3404 –0.3 45 V
LM3404HV –0.3 76
BOOT to SW –0.3 14 V
VCC to GND –0.3 14 V
DIM to GND –0.3 7 V
CS to GND –0.3 7 V
RON to GND –0.3 7 V
Soldering information Lead temperature (soldering, 10 s) 260 °C
Infrared or convection reflow (15 s) 235
Junction temperature 150 °C
Storage temperature –65 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military or Aerospace specified devices are required, contact the Texas Instruments Semiconductor Sales Office or Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
VIN LM3404 6 42 V
LM3404HV 6 75
Junction Temperature Range LM3404 –40 125 °C
LM34040HV –40 125
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see Electrical Characteristics.

6.4 Thermal Information

THERMAL METRIC(1) LM3404, LM3404HV UNIT
SOIC SO PowerPAD
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 106.8 44.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.2 51.2 °C/W
RθJB Junction-to-board thermal resistance 48.7 24.5 °C/W
ψJT Junction-to-top characterization parameter 6.7 6.8 °C/W
ψJB Junction-to-board characterization parameter 48 24.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 2.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VIN = 24 V (unless otherwise noted).
–40°C ≤ TJ ≤ 125°C. (2)
PARAMETER CONDITIONS MIN TYP MAX UNIT
REGULATION AND OVERVOLTAGE COMPARATORS
VREF-REG CS Regulation Threshold CS Decreasing, SW turns on 194 200 206 mV
VREF-0V CS Overvoltage Threshold CS Increasing, SW turns off 300 mV
ICS CS Bias Current CS = 0 V 0.1 µA
SHUTDOWN
VSD-TH Shutdown Threshold RON / SD Increasing 0.3 0.7 1.05 V
VSD-HYS Shutdown Hysteresis RON / SD Decreasing 40 mV
INTERNAL REGULATOR
VCC-REG VCC Regulated Output 6.4 7 7.4 V
VIN-DO VIN – VCC ICC = 5 mA, 6 V < VIN < 8 V 300 mV
VCC-BP-TH VCC Bypass Threshold VIN Increasing 8.8 V
VCC-BP-HYS VCC Bypass Hysteresis VIN Decreasing 230 mV
VCC-Z-6 VCC Output Impedance
(0 mA < ICC < 5 mA)		 VIN = 6 V 55 Ω
VCC-Z-8 VIN = 8 V 50 Ω
VCC-Z-24 VIN = 24 V 0.4 Ω
VCC-LIM VCC Current Limit (1) VIN = 24 V, VCC = 0 V 16 mA
VCC-UV-TH VCC Undervoltage Lock-out Threshold VCC Increasing 5.3 V
VCC-UV-HYS VCC Undervoltage Lock-out Hysteresis VCC Decreasing 150 mV
VCC-UV-DLY VCC Undervoltage Lock-out Filter Delay 100-mV Overdrive 3 µs
IIN-OP IIN Operating Current Non-switching, CS = 0.5 V 625 900 µA
IIN-SD IIN Shutdown Current RON / SD = 0 V 95 180 µA
CURRENT LIMIT
ILIM Current Limit Threshold 1.2 1.5 1.8 A
DIM COMPARATOR
VIH Logic High DIM Increasing 2.2 V
VIL Logic Low DIM Decreasing 0.8 V
IDIM-PU DIM Pullup Current DIM = 1.5 V 80 µA
MOSFET AND DRIVER
RDS-ON Buck Switch On Resistance ISW = 200 mA, BST-SW = 6.3 V 0.37 0.75 Ω
VDR-UVLO BST Undervoltage Lock-out Threshold BST–SW Increasing 1.7 3 4 V
VDR-HYS BST Undervoltage Lock-out Hysteresis BST–SW Decreasing 400 mV
THERMAL SHUTDOWN
TSD Thermal Shutdown Threshold 165 °C
TSD-HYS Thermal Shutdown Hysteresis 25 °C
(1) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
(2) Typical specifications represent the most likely parametric norm at 25°C operation.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SYSTEM PARAMETERS - LM3404
tON-1 On-time 1 VIN = 10 V, RON = 200 kΩ 2.1 2.75 3.4 µs
tON-2 On-time 2 VIN = 40 V, RON = 200 kΩ 515 675 835 ns
SYSTEM PARAMETERS - LM3404HV
tON-1 On-time 1 VIN = 10 V, RON = 200 kΩ 2.1 2.75 3.4 µs
tON-2 On-time 2 VIN = 70 V, RON = 200 kΩ 325 415 505 ns
OFF TIMER
tOFF-MIN Minimum Off-time CS = 0 V 270 ns

6.7 Typical Characteristics

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LM3404 LM3404HV 20205450.png
VIN = 24 V
Figure 1. VREF vs Temperature
LM3404 LM3404HV 20205452.png
TA = 25°C
Figure 3. VREF vs VIN, LM3404HV
LM3404 LM3404HV 20205454.png
TA = 25°C
Figure 5. Current Limit vs VIN, LM3404
LM3404 LM3404HV 20205435.png
TA = 25°C
Figure 7. TON vs VIN, RON = 100 kΩ
LM3404 LM3404HV 20205437.png
TA = 25°C
Figure 9. TON vs VIN
LM3404 LM3404HV 20205438.png
TA = 25°C
Figure 11. TON vs RON, LM3404HV
LM3404 LM3404HV 20205440.png
TA = 25°C
Figure 13. VO-MAX vs fSW, LM3404
LM3404 LM3404HV 20205442.png
TA = 25°C
Figure 15. VO-MAX vs fSW, LM3404HV
LM3404 LM3404HV 20205451.png
TA = 25°C
Figure 2. VREF vs VIN, LM3404
LM3404 LM3404HV 20205453.png
VIN = 24 V
Figure 4. Current Limit vs Temperature
LM3404 LM3404HV 20205455.png
TA = 25°C
Figure 6. Current Limit vs VIN, LM3404HV
LM3404 LM3404HV 20205436.png
TA = 25°C
Figure 8. TON vs VIN
LM3404 LM3404HV 20205444.png
TA = 25°C
Figure 10. TON vs RON, LM3404
LM3404 LM3404HV 20205439.png
TA = 25°C
Figure 12. VCC vs VIN
LM3404 LM3404HV 20205441.png
TA = 25°C
Figure 14. VO-MIN vs fSW, LM3404
LM3404 LM3404HV 20205443.png
TA = 25°C
Figure 16. VO-MIN vs fSW, LM3404HV