SNVS541H October   2007  – August 2016 LM3410 , LM3410-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 DIM Pin and Shutdown Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Boost Converter
        1. 8.1.1.1 Setting the LED Current
        2. 8.1.1.2 LED-Drive Capability
        3. 8.1.1.3 Inductor Selection
        4. 8.1.1.4 Input Capacitor
        5. 8.1.1.5 Output Capacitor
        6. 8.1.1.6 Diode
        7. 8.1.1.7 Output Overvoltage Protection
      2. 8.1.2 SEPIC Converter
        1. 8.1.2.1 SEPIC Equations
        2. 8.1.2.2 Steady State Analysis with Loss Elements
          1. 8.1.2.2.1 Details
    2. 8.2 Typical Applications
      1. 8.2.1  Low Input Voltage, 1.6-MHz, 3 to 5 White LED Output at 50-mA Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Set the LED Current (R1)
          2. 8.2.1.2.2 Calculate Maximum Duty Cycle (DMAX)
          3. 8.2.1.2.3 Calculate the Inductor Value (L1)
          4. 8.2.1.2.4 Calculate the Output Capacitor (C2)
          5. 8.2.1.2.5 Input Capacitor (C1) and Schottky Diode (D1)
        3. 8.2.1.3 Application Curves
      2. 8.2.2  LM3410X SOT-23: 5 × 1206 Series LED String Application
        1. 8.2.2.1 Design Requirements
      3. 8.2.3  LM3410Y SOT-23: 5 × 1206 Series LED String Application
        1. 8.2.3.1 Design Requirements
      4. 8.2.4  LM3410X WSON: 7 × 5 LED Strings Backlighting Application
        1. 8.2.4.1 Design Requirements
      5. 8.2.5  LM3410X WSON: 3 × HB LED String Application
        1. 8.2.5.1 Design Requirements
      6. 8.2.6  LM3410Y SOT-23: 5 × 1206 Series LED String Application With OVP
        1. 8.2.6.1 Design Requirements
      7. 8.2.7  LM3410X SEPIC WSON: HB or OLED Illumination Application
        1. 8.2.7.1 Design Requirements
      8. 8.2.8  LM3410X WSON: Boost Flash Application
        1. 8.2.8.1 Design Requirements
      9. 8.2.9  LM3410X SOT-23: 5 × 1206 Series LED String Application With VIN > 5.5 V
        1. 8.2.9.1 Design Requirements
      10. 8.2.10 LM3410X WSON: Camera Flash or Strobe Circuit Application
        1. 8.2.10.1 Design Requirements
      11. 8.2.11 LM3410X SOT-23: 5 × 1206 Series LED String Application With VIN and VPWR Rail > 5.5 V
        1. 8.2.11.1 Design Requirements
      12. 8.2.12 LM3410X WSON: Boot-Strap Circuit to Extend Battery Life
        1. 8.2.12.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Design
      2. 10.3.2 LM3410 and LM3410-Q1 Thermal Models
      3. 10.3.3 Calculating Efficiency and Junction Temperature
        1. 10.3.3.1 Quiescent Power Losses
        2. 10.3.3.2 RSET Power Losses
      4. 10.3.4 Example Efficiency Calculation
      5. 10.3.5 Calculating RθJA and RΨJC
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage VIN –0.5 7 V
SW –0.5 26.5
FB –0.5 3
DIM –0.5 7
Operating juction temperature(3), TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) Thermal shutdown occurs if the junction temperature exceeds the maximum junction temperature of the device.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 2.7 5.5 V
VDIM DIM control input(1) 0 VIN V
VSW Switch output 3 24 V
TJ Operating junction temperature –40 125 °C
Power dissipation (Internal) SOT-23 400 mW
(1) Do not allow this pin to float or be greater than VIN + 0.3 V.

6.4 Thermal Information

THERMAL METRIC(1) LM3410, LM3410-Q1 UNIT
NGG
(WSON)		 DGN (MSOP-PowerPAD) DBV
(SOT-23)
6 PINS 8 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 0 LFPM Air Flow 55.3 53.7 164.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.9 61.4 115.3 °C/W
RθJB Junction-to-board thermal resistance 29.6 37.3 27 °C/W
ψJT Junction-to-top characterization parameter 1.1 7.1 12.8 °C/W
ψJB Junction-to-board characterization parameter 29.7 37 26.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.3 6.8 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Typical values apply for TJ = 25°C; Minimum and maximum limits apply for TJ = –40°C to 125°C and VIN = 5 V (unless otherwise noted). Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Feedback voltage 178 190 202 mV
ΔVFB/VIN Feedback voltage line regulation VIN = 2.7 V to 5.5 V 0.06 %/V
IFB Feedback input bias current 0.1 1 µA
fSW Switching frequency LM3410X 1200 1600 2000 kHz
LM3410Y 360 525 680
DMAX Maximum duty cycle LM3410X 88% 92%
LM3410Y 90% 95%
DMIN Minimum duty cycle LM3410X 5%
LM3410Y 2%
RDS(ON) Switch on resistance MSOP and SOT-23 170 330 mΩ
WSON 190 350
ICL Switch current limit 2.1 2.8 A
SU Start-up time 20 µs
IQ Quiescent current (switching) LM3410X, VFB = 0.25 V 7 11 mA
LM3410Y, VFB = 0.25 V 3.4 7
Quiescent current (shutdown) All versions, VDIM = 0 V 80 nA
UVLO Undervoltage lockout VIN rising 2.3 2.65 V
VIN falling 1.7 1.9
VDIM_H Shutdown threshold voltage 0.4 V
Enable threshold voltage 1.8
ISW Switch leakage VSW = 24 V 1 µA
IDIM Dimming pin current Sink and source 100 nA
TSD Thermal shutdown temperature (1) 165 °C
(1) Thermal shutdown occurs if the junction temperature exceeds the maximum junction temperature of the device.

6.6 Typical Characteristics

All curves taken at VIN = 5 V with the 50-mA boost configuration shown in Figure 18. TJ = 25°C, unless otherwise specified.
LM3410 LM3410-Q1 30038502.gif
RSET = 4 Ω
Figure 1. LM3410X Efficiency vs VIN
LM3410 LM3410-Q1 30038508.png
500-Hz DIM Frequency D = 50%
Figure 3. Four 3.3-V LEDs
LM3410 LM3410-Q1 30038510.png Figure 5. Current Limit vs Temperature
LM3410 LM3410-Q1 30038512.png
LM3410X
Figure 7. Oscillator Frequency vs Temperature
LM3410 LM3410-Q1 30038580.png Figure 9. VFB vs Temperature
LM3410 LM3410-Q1 30038507.png
Figure 2. LM3410X Start-Up Signature
LM3410 LM3410-Q1 30038509.png
Figure 4. DIM Frequency and Duty Cycle vs Average ILED
LM3410 LM3410-Q1 30038511.png Figure 6. RDS(ON) vs Temperature
LM3410 LM3410-Q1 30038513.png
LM3410Y
Figure 8. Oscillator Frequency vs Temperature