SNVSBU7 September   2020 LM34966-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Line Undervoltage Lockout (UVLO/SYNC/EN Pin)
      2. 8.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 8.3.3  Soft Start (SS Pin)
      4. 8.3.4  Switching Frequency (RT Pin)
      5. 8.3.5  Clock Synchronization (UVLO/SYNC/EN Pin)
      6. 8.3.6  Current Sense and Slope Compensation (CS Pin)
      7. 8.3.7  Current Limit and Minimum On-time (CS Pin)
      8. 8.3.8  Feedback and Error Amplifier (FB, COMP Pin)
      9. 8.3.9  Power-Good Indicator (PGOOD Pin)
      10. 8.3.10 Hiccup Mode Overload Protection
      11. 8.3.11 Maximum Duty Cycle Limit and Minimum Input Supply Voltage
      12. 8.3.12 MOSFET Driver (GATE Pin)
      13. 8.3.13 Overvoltage Protection (OVP)
      14. 8.3.14 Thermal Shutdown (TSD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Run Mode
  9. 9 Application and Implementation
    1. 9.1 Power-On Hours (POH)
    2. 9.2 Application Information
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Custom Design With WEBENCH® Tools
        2. 9.3.2.2 Recommended Components
        3. 9.3.2.3 Inductor Selection (LM)
        4. 9.3.2.4 Output Capacitor (COUT)
        5. 9.3.2.5 Input Capacitor
        6. 9.3.2.6 MOSFET Selection
        7. 9.3.2.7 Diode Selection
        8. 9.3.2.8 Efficiency Estimation
      3. 9.3.3 Application Curve
    4. 9.4 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 2		±2000V
Charged-device model (CDM), per AEC Q100-011
CDM ESD Classification Level C4B		All pins±500
Corner pins±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.