SNVS569C May   2009  – October 2016 LM3550

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 STROBE Pin
      2. 7.3.2 End-of-Charge Pin (EOC)
      3. 7.3.3 ALD/TEMP Pin
      4. 7.3.4 IND Pin
      5. 7.3.5 BAL Pin
      6. 7.3.6 Super-Capacitor Charging Time
      7. 7.3.7 Super-Capacitor Voltage Profile
      8. 7.3.8 Peak Flash Current
      9. 7.3.9 Maximum Flash Duration
    4. 7.4 Device Functional Modes
      1. 7.4.1 State Machine Description
        1. 7.4.1.1 Basic Description
        2. 7.4.1.2 Shutdown State
        3. 7.4.1.3 Torch State
        4. 7.4.1.4 Charge State
          1. 7.4.1.4.1 Fixed-Voltage-Charge Mode
          2. 7.4.1.4.2 Optimal Charge Mode
        5. 7.4.1.5 Torch and Charge State
        6. 7.4.1.6 Flash State
        7. 7.4.1.7 EOC Functionality
        8. 7.4.1.8 State Diagram FGATE = 1
        9. 7.4.1.9 Optimal Charge Mode vs Fixed Voltage Mode
          1. 7.4.1.9.1 Optimal Charge Mode vs Fixed Voltage Mode
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Child Address: 0x53
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
        1. 7.6.1.1 General Purpose Register Description
        2. 7.6.1.2 Current Control Register Description
        3. 7.6.1.3 Options Control Register Description
        4. 7.6.1.4 ALD/TEMP Sense High/Low Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Super-Capacitor
          2. 8.2.2.1.2 Boost Capacitors
          3. 8.2.2.1.3 Current Source FET
          4. 8.2.2.1.4 ALD/TEMP Components
            1. 8.2.2.1.4.1 NTC Selection
            2. 8.2.2.1.4.2 Ambient Light Sensor
          5. 8.2.2.1.5 Thermal Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
    2. 11.2 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.