SNVS402I February   2006  – May 2021 LM5009

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 High Voltage Startup Regulator
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 On-Time Generator
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Resistor Divider Selection
        2. 8.2.2.2 Frequency Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 VCC and Bootstrap Capacitor
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Current Limit Off-Timer Setting
        7. 8.2.2.7 Rectifier Diode Selection
        8. 8.2.2.8 Input Capacitor Selection
        9. 8.2.2.9 Ripple Configuration
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Typical limits are for TJ = 25°C only, and all maximum and minimum limits apply over the junction temperature (TJ) range of –40°C to +125°C. Minimum and maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN = 48 V and RON = 200 kΩ.(1).
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VCC SUPPLY
VCC regVCC regulator output6.677.4V
VCC current limit(2)9.5mA
VCC undervoltage lockout voltage (VCC increasing)6.3V
VCC undervoltage hysteresis200mV
VCC UVLO delay (filter)100-mV overdrive10µs
IIN operating currentNon-switching, FB = 3 V485675µA
IIN shutdown currentRON/SD = 0 V76150µA
SWITCH CHARACTERISTICS
Buck switch Rds(on)ITEST = 200 mA(3)2.04.4Ω
Gate drive UVLOVBST − VSW rising3.44.55.5V
Gate drive UVLO hysteresis430mV
CURRENT LIMIT
Current limit threshold0.250.310.37A
Current limit response timeIswitch overdrive = 0.1-A time to switch off400ns
OFF time generator (test 1)FB = 0 V, RCL = 100 kΩ35µs
OFF time generator (test 2)FB = 2.3 V, RCL = 100 kΩ2.56µs
ON TIME GENERATOR
TON - 1VIN = 10 V, RON = 200 kΩ2.152.773.5µs
TON - 2VIN = 95 V, RON = 200 kΩ200300420ns
Remote shutdown thresholdRising0.40.71.05V
Remote shutdown hysteresis35mV
MINIMUM OFF TIME
Minimum off timerFB = 0 V300ns
REGULATION AND OV COMPARATORS
FB reference thresholdInternal reference, trip point for switch on2.4452.52.550V
FB overvoltage thresholdTrip point for switch off2.875V
FB bias current1nA
THERMAL SHUTDOWN
TsdThermal shutdown temperature165°C
Thermal shutdown hysteresis25°C
(1) All electrical characteristics having room temperature limits are tested during production with TA = TJ = 25°C. All hot and cold limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
(2) The VCC output is intended as a self bias for the internal gate drive power and control circuits. Device thermal limitations limit external loading.
(3) For devices procured in the WSON-8 package, the Rds(on) limits are specified by design characterization data only.