SNVS499I February   2007  – November 2023 LM5116

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Performance Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Voltage Start-Up Regulator
      2. 6.3.2 Enable
      3. 6.3.3 UVLO
      4. 6.3.4 Oscillator and Sync Capability
      5. 6.3.5 Error Amplifier and PWM Comparator
      6. 6.3.6 Ramp Generator
      7. 6.3.7 Current Limit
      8. 6.3.8 HO Output
      9. 6.3.9 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Soft-Start and Diode Emulation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Custom Design with WEBENCH® Tools
        2. 7.2.2.2  Timing Resistor
        3. 7.2.2.3  Output Inductor
        4. 7.2.2.4  Current Sense Resistor
        5. 7.2.2.5  Ramp Capacitor
        6. 7.2.2.6  Output Capacitors
        7. 7.2.2.7  Input Capacitors
        8. 7.2.2.8  VCC Capacitor
        9. 7.2.2.9  Bootstrap Capacitor
        10. 7.2.2.10 Soft Start Capacitor
        11. 7.2.2.11 Output Voltage Divider
        12. 7.2.2.12 UVLO Divider
        13. 7.2.2.13 MOSFETs
        14. 7.2.2.14 MOSFET Snubber
        15. 7.2.2.15 Error Amplifier Compensation
        16. 7.2.2.16 Comprehensive Equations
          1. 7.2.2.16.1 Current Sense Resistor and Ramp Capacitor
          2. 7.2.2.16.2 Modulator Transfer Function
          3. 7.2.2.16.3 Error Amplifier Transfer Function
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design with WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision H (July 2015) to Revision I (November 2023)

  • Added new, similar product introduction in Features sectionGo
  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Added new, similar product introduction in Description sectionGo
  • Changed from BODY SIZE to PACKAGE SIZE and added a table note in the Package Information tableGo

Changes from Revision G (March 2013) to Revision H (July 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from Revision F (March 2013) to Revision G (March 2013)

  • Changed layout of National Data Sheet to TI formatGo