SLVSFF1B December   2021  – December 2022 LM5123-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Enable/Disable (EN, VH Pin)
      2. 8.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 8.3.3  Light Load Switching Mode Selection (MODE Pin)
      4. 8.3.4  VOUT Range Selection (RANGE Pin)
      5. 8.3.5  Line Undervoltage Lockout (UVLO Pin)
      6. 8.3.6  Fast Restart using VCC HOLD (VH Pin)
      7. 8.3.7  Adjustable Output Regulation Target (VOUT, TRK, VREF Pin)
      8. 8.3.8  Overvoltage Protection (VOUT Pin)
      9. 8.3.9  Power Good Indicator (PGOOD Pin)
      10. 8.3.10 Dynamically Programmable Switching Frequency (RT)
      11. 8.3.11 External Clock Synchronization (SYNC Pin)
      12. 8.3.12 Programmable Spread Spectrum (DITHER Pin)
      13. 8.3.13 Programmable Soft Start (SS Pin)
      14. 8.3.14 Wide Bandwidth Transconductance Error Amplifier and PWM (TRK, COMP Pin)
      15. 8.3.15 Current Sensing and Slope Compensation (CSP, CSN Pin)
      16. 8.3.16 Constant Peak Current Limit (CSP, CSN Pin)
      17. 8.3.17 Maximum Duty Cycle and Minimum Controllable On-Time Limits
      18. 8.3.18 Deep Sleep Mode and Bypass Operation (HO, CP Pin)
      19. 8.3.19 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB Pin)
      20. 8.3.20 Thermal Shutdown Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Status
        1. 8.4.1.1 Shutdown Mode
        2. 8.4.1.2 Configuration Mode
        3. 8.4.1.3 Active Mode
        4. 8.4.1.4 Sleep Mode
        5. 8.4.1.5 Deep Sleep Mode
      2. 8.4.2 Light Load Switching Mode
        1. 8.4.2.1 Forced PWM (FPWM) Mode
        2. 8.4.2.2 Diode Emulation (DE) Mode
        3. 8.4.2.3 Forced Diode Emulation Operation in FPWM Mode
        4. 8.4.2.4 Skip Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Application Ideas
      3. 9.2.3 Application Curves
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGR|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.19 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB Pin)

The device provides N-channel logic MOSFET drivers, which can source a peak current of 2.2 A and sink a peak current of 3.3 A. The LO driver is powered by VCC, and is enabled when EN is greater than VEN and VCC is greater than VVCC-UVLO. The HO driver is powered by HB, and is enabled when EN is greater than VEN and HB-SW voltage is greater than HB UVLO threshold (VHB-UVLO).

When the SW pin voltage is approximately 0 V by turning on the low-side MOSFET, the CHB is charged from VCC through the internal boot diode. The recommended value of the CHB is 0.1 μF.

The LO and HO outputs are controlled with an adaptive dead-time methodology which ensures that both outputs are not turned on at the same time. When the device commands LO to be turned on, the adaptive dead-time logic first turns off HO and waits for HO-SW voltage to drop. LO is then turned on after a small delay (tDHL). Similarly, the HO driver turn-on is delayed until the LO-PGND voltage has discharged. HO is then turned on after a small delay (tDLH).

If the BIAS pin voltage is below the 5-V VCC regulation target, take extra care when selecting the MOSFETs. The gate plateau voltage of the MOSFET switch must be less than the BIAS pin voltage to completely enhance the MOSFET, especially during start-up at low BIAS pin voltage. If the driver output voltage is lower than the MOSFET gate plateau voltage during start-up, the converter may not start up properly and it can stick at the maximum duty cycle in a high-power dissipation state. This condition can be avoided by selecting a lower threshold MOSFET or by turning on the device when the BIAS pin voltage is sufficient. Care should be taken when the converter operates in bypass at any conditions. During the bypass operation, the minimum HO-SW voltage is 3.75 V.

Figure 8-19 Driver Structure with Internal Boot Diode

The hiccup mode fault protection is triggered by the HB UVLO. If the HB-SW voltage is less than the HB UVLO threshold (VHB-UVLO), the LO turns on by force for 75 ns to replenish the boost capacitor. The device allows up to four consecutive replenish switching. After the maximum four consecutive boot replenish switching, the device skips switching for 12 cycles. If the device fails to replenish the boost capacitor after the four sets of the four consecutive replenish switching, the device stops switching and enters 512 cycles of hiccup mode off time. During the hiccup mode off time, PGOOD and SS are grounded.

If required, the slew rate of the switching node voltage can be adjusted by adding a gate resistor in parallel with a pulldown PNP transistor. Extra care should be taken when adding the gate resistor since it can decrease the effective dead-time.

GUID-20200816-CA0I-XD4Q-TNKT-DQWNT2ZTJPP4-low.gif Figure 8-20 Slew Rate Control