SNAS660D June   2015  – May 2021 LM53600-Q1 , LM53601-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Scheme
      2. 8.3.2 Soft-Start Function
      3. 8.3.3 Current Limit
      4. 8.3.4 Hiccup Mode
      5. 8.3.5 RESET Function
      6. 8.3.6 Forced PWM Operation
      7. 8.3.7 Auto Mode Operation and IQ_VIN
      8. 8.3.8 SYNC Operation
      9. 8.3.9 Spread Spectrum
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown
      2. 8.4.2 FPWM Operation
      3. 8.4.3 Auto Mode Operation
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Off-Battery 5-V, 1-A Output Automotive Converter with Spread Spectrum
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection
          2. 9.2.1.2.2 Output Capacitor Selection
          3. 9.2.1.2.3 Input Capacitor Selection
          4. 9.2.1.2.4 FB Voltage Divider for Adjustable Versions
          5. 9.2.1.2.5 RPU - RESET Pull Up Resistor
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Off-Battery 3.3 V, 1 A Output Automotive Converter with Spread Spectrum
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Do's and Don't's
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Plane Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)LM53600-Q1,
LM53601-Q1		UNIT
DSX (WSON)
10 PINS
RθJAJunction -to-ambient thermal resistance46.2°C/W
RθJCJunction -to-case (top) thermal resistance31.5°C/W
RθJBJunction -to-board thermal resistance20.9°C/W
φJTJunction- to-top characterization parameter0.3°C/W
φJBJunction-to-board characterization parameter21.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).