SNVSAW8E March   2020  – April 2022 LM62440-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Characteristics
    7. 8.7 Systems Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  EN Uses for Enable and VIN UVLO
      2. 9.3.2  MODE/SYNC Pin Operation
        1. 9.3.2.1 Level-Dependent MODE/SYNC Pin Control
        2. 9.3.2.2 Pulse-Dependent MODE/SYNC Pin Control
        3. 9.3.2.3 Clock Locking
      3. 9.3.3  PGOOD Output Operation
      4. 9.3.4  Internal LDO, VCC UVLO, and BIAS Input
      5. 9.3.5  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
      6. 9.3.6  Adjustable SW Node Slew Rate
      7. 9.3.7  Spread Spectrum
      8. 9.3.8  Soft Start and Recovery From Dropout
      9. 9.3.9  Output Voltage Setting
      10. 9.3.10 Overcurrent and Short Circuit Protection
      11. 9.3.11 Thermal Shutdown
      12. 9.3.12 Input Supply Current
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Standby Mode
      3. 9.4.3 Active Mode
        1. 9.4.3.1 CCM Mode
        2. 9.4.3.2 Auto Mode – Light-Load Operation
          1. 9.4.3.2.1 Diode Emulation
          2. 9.4.3.2.2 Frequency Reduction
        3. 9.4.3.3 FPWM Mode – Light-Load Operation
        4. 9.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 9.4.3.5 Dropout
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Choosing the Switching Frequency
        2. 10.2.2.2  Setting the Output Voltage
        3. 10.2.2.3  Inductor Selection
        4. 10.2.2.4  Output Capacitor Selection
        5. 10.2.2.5  Input Capacitor Selection
        6. 10.2.2.6  BOOT Capacitor
        7. 10.2.2.7  BOOT Resistor
        8. 10.2.2.8  VCC
        9. 10.2.2.9  BIAS
        10. 10.2.2.10 CFF and RFF Selection
        11. 10.2.2.11 External UVLO
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Ground and Thermal Considerations
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Thermal Information

The value of RθJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application. For example, with a 4-layer PCB, a RΘJA = 25℃/W can be achieved. For design information see Maximum Ambient Temperature versus Output Current.
THERMAL METRIC (1) LM62440-Q1 UNIT
RJR (QFN)
14 PINS
RθJA Junction-to-ambient thermal resistance (LM61460-Q1 EVM)     25 °C/W
RθJA Junction-to-ambient thermal resistance (JESD 51-7) 58.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 26.1 °C/W
RθJB Junction-to-board thermal resistance 19.2 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
ΨJB Junction-to-board characterization parameter 19 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.