SNVSCH2 September   2024 LM65645-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1 Output Voltage Selection
      2. 7.3.2 EN Pin and Use as VIN UVLO
      3. 7.3.3 Mode Selection
        1. 7.3.3.1 MODE/SYNC Pin Uses for Synchronization
        2. 7.3.3.2 Clock Locking
      4. 7.3.4 Adjustable Switching Frequency
      5. 7.3.5 Dual Random Spread Spectrum (DRSS)
      6. 7.3.6 Internal LDO, VCC UVLO, and BIAS Input
      7. 7.3.7 Bootstrap Voltage (BST Pin)
      8. 7.3.8 Soft Start and Recovery From Dropout
      9. 7.3.9 Safety Features
        1. 7.3.9.1 Power-Good Monitor
        2. 7.3.9.2 Overcurrent and Short-Circuit Protection
        3. 7.3.9.3 Hiccup
        4. 7.3.9.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Choosing the Switching Frequency
        3. 8.2.2.3 FB for Adjustable or Fixed Output Voltage Mode
        4. 8.2.2.4 Inductor Selection
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Input Capacitor Selection
        7. 8.2.2.7 CBOOT
        8. 8.2.2.8 External UVLO
        9. 8.2.2.9 Maximum Ambient Temperature
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • RZT|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.8 Soft Start and Recovery From Dropout

When designing with the LM656x5-Q1, slower rise in output voltage due to recovery from dropout and soft start must be considered separate phenomena. Soft start is triggered by any of the following conditions:

  • EN is used to turn on the device.
  • Recovery from a hiccup waiting period; see Section 7.3.9.3.
  • Recovery from shutdown due to overtemperature protection.
  • Power is applied to the VIN of the IC or the VCC UVLO is released.

After soft start is initiated, the IC takes the following actions:

  • The reference used by the IC to regulate output voltage is slowly ramping up from zero. The net result is that output voltage, if previously 0V, takes tSS to reach 90% of regulation value.
  • Operating mode is set to auto, activating diode emulation. This allows start-up without pulling the output voltage low if there is a voltage already present on the output.
  • Hiccup is disabled for the duration of soft start; see Section 7.3.9.3.

All of these actions together provide a controlled start-up with limited inrush current. These actions also allow the use of output capacitors and loading conditions that can cause current limit during start-up without triggering hiccup. In addition, if the output voltage is already present the output voltage does not discharge.

Any time the output voltage is more than a few percent low for any reason, the output voltage ramps back up slowly. This is the recovery from dropout condition which differs from soft start in three important ways:

  • Hiccup is allowed only if output voltage is less than 40 percent the set point. Note that during dropout regulation, hiccup is inhibited. See Section 7.3.9.3.
  • FPWM mode is allowed during recovery from dropout. If the output voltage were to suddenly be pulled up by an external supply, the LM656x5-Q1can pull down on the output. Note that all the protections that are present during normal operation are in place, protecting the device if output is shorted to a high voltage or ground.
  • The reference voltage is set to approximately 1% above that needed to achieve the current output voltage. The reference voltage is not started from zero.

Despite the name, recovery from dropout is active whenever output voltage is more than a few percent lower than the setpoint for long enough that:

  • Duty factor is controlled by minimum on-time or
  • When the part is operating in current limit.
This primarily occurs under the following conditions:

  • Dropout: When there is insufficient input voltage for the desired output voltage to be generated.
  • Overcurrent that is not severe enough to trigger hiccup or if the duration is too short to trigger hiccup. See Section 7.3.9.3.
LM65645-Q1 Recovery From Dropout
Whether output voltage falls due to high load or low input voltage, after the condition that causes output to fall below the setpoint is removed, output climbs at the same speed as during start-up. Even though hiccup does not trigger due to dropout, hiccup can, in principal, be triggered during recovery if output voltage is below 0.4 times output the setpoint for more than 128 clock cycles during recovery.
Figure 7-8 Recovery From Dropout