SNIS194 December   2016 LM73-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics- Digital DC Characteristics
    7. 6.7 SMBus Digital Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-On Reset
      2. 7.3.2 One-Shot Conversion
      3. 7.3.3 Temperature Data Format
      4. 7.3.4 SMBus Interface
      5. 7.3.5 ALERT Function
      6. 7.3.6 Communicating With the LM73-Q1
        1. 7.3.6.1 Reading from the LM73-Q1
        2. 7.3.6.2 Writing to the LM73-Q1
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
    5. 7.5 Register Map
      1. 7.5.1 LM73-Q1 Registers
        1. 7.5.1.1 Pointer Register
        2. 7.5.1.2 Temperature Data Register
        3. 7.5.1.3 Configuration Register
        4. 7.5.1.4 THIGH Upper-Limit Register
        5. 7.5.1.5 TLOW Lower-Limit Register
        6. 7.5.1.6 Control/Status Register
        7. 7.5.1.7 Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Thermal Path Considerations
      2. 8.1.2 Output Considerations: Tight Accuracy, Resolution and Low Noise
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Related Documentation

For related documentation see the following:

Semiconductor and IC Package Thermal Metrics

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.