SNIS194 December   2016 LM73-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics- Digital DC Characteristics
    7. 6.7 SMBus Digital Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-On Reset
      2. 7.3.2 One-Shot Conversion
      3. 7.3.3 Temperature Data Format
      4. 7.3.4 SMBus Interface
      5. 7.3.5 ALERT Function
      6. 7.3.6 Communicating With the LM73-Q1
        1. 7.3.6.1 Reading from the LM73-Q1
        2. 7.3.6.2 Writing to the LM73-Q1
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
    5. 7.5 Register Map
      1. 7.5.1 LM73-Q1 Registers
        1. 7.5.1.1 Pointer Register
        2. 7.5.1.2 Temperature Data Register
        3. 7.5.1.3 Configuration Register
        4. 7.5.1.4 THIGH Upper-Limit Register
        5. 7.5.1.5 TLOW Lower-Limit Register
        6. 7.5.1.6 Control/Status Register
        7. 7.5.1.7 Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Thermal Path Considerations
      2. 8.1.2 Output Considerations: Tight Accuracy, Resolution and Low Noise
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

To achieve the expected results when measuring temperature with an integrated circuit temperature sensor like the LM73-Q1, it is important to understand that the sensor measures its own die temperature. For the LM73-Q1, the best thermal path between the die and the outside world is through the LM73-Q1's pins. In the SOT-23 package, all the pins on the LM73-Q1 will have an equal effect on the die temperature. Because the pins represent a good thermal path to the LM73-Q1 die, the LM73-Q1 will provide an accurate measurement of the temperature of the printed circuit board on which it is mounted.

10.2 Layout Example

LM73-Q1 LM73.gif Figure 15. PBC Layout