SNVSB12B November   2017  – May 2021 LM73605-Q1 , LM73606-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Synchronous Step-Down Regulator
      2. 8.3.2  Auto Mode and FPWM Mode
      3. 8.3.3  Fixed-Frequency Peak Current-Mode Control
      4. 8.3.4  Adjustable Output Voltage
      5. 8.3.5  Enable and UVLO
      6. 8.3.6  Internal LDO, VCC_UVLO, and BIAS Input
      7. 8.3.7  Soft Start and Voltage Tracking
      8. 8.3.8  Adjustable Switching Frequency
      9. 8.3.9  Frequency Synchronization and Mode Setting
      10. 8.3.10 Internal Compensation and CFF
      11. 8.3.11 Bootstrap Capacitor and VBOOT-UVLO
      12. 8.3.12 Power-Good and Overvoltage Protection
      13. 8.3.13 Overcurrent and Short-Circuit Protection
      14. 8.3.14 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 DCM Mode
        3. 8.4.3.3 PFM Mode
        4. 8.4.3.4 Fault Protection Mode
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Layout For EMI Reduction
      2. 9.1.2 Ground Plane
      3. 9.1.3 Optimize Thermal Performance
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Support Resources
    7. 10.7 Trademarks
    8. 10.8 Electrostatic Discharge Caution
    9. 10.9 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 System Characteristics

The following specifications apply to the circuit found in typical schematic with appropriate modifications from typical bill of materials. These parameters are not tested in production and represent typical performance only. Unless otherwise stated the following conditions apply: TA = 25°C, VIN = 12 V, VOUT = 3.3 V, fSW = 500 kHz.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VFB_PFMOutput voltage offset at no load in auto modeVIN = 3.8 V to 36 V, VSYNC = 0 V, auto mode IOUT = 0 A2%
VDROPMinimum input to output voltage differential to maintain specified accuracyVOUT = 5 V, IOUT = 3 A, fSW = 2.2 MHz0.4V
IQ_SWOperating quiescent current (switching)VEN = 3.3 V, IOUT = 0 A, RT = open, VBIAS = VOUT = 3.3 V , RFBT = 1 Meg15µA
IPEAK_MINMinimum inductor peak currentLM73605-Q1:
VSYNC = 0, IOUT = 10 mA		1A
LM73606-Q1:
VSYNC = 0 V, IOUT = 10 mA		1.3
IBIAS_SWOperating quiescent current from external VBIAS (switching)fSW = 500 kHz, IOUT = 1 A7mA
fSW = 2.2 MHz, IOUT = 1 A25
DMAXMaximum switch duty cycleWhile in frequency foldback97.5%
tDEADDead time between high-side and low-side MOSFETs4ns