SNIS128D August   2002  – June 2014 LM89

UNLESS OTHERWISE NOTED, this document contains ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Remote Diode Temperature Sensor System Diagram
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration And Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Temperature-To-Digital Converter Characteristics
    6. 8.6 Digital DC Characteristics
    7. 8.7 Timing Requirements
    8. 8.8 SMBus Digital Switching Characteristics
    9. 8.9 Typical Characteristics
  9. 9  Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Conversion Sequence
      2. 9.3.2  The ALERT Output
        1. 9.3.2.1 ALERT Output As A Temperature Comparator
        2. 9.3.2.2 ALERT Output As An Interrupt
        3. 9.3.2.3 ALERT Output As An SMBus Alert
      3. 9.3.3  T_CRIT_A Output And T_CRIT Limit
      4. 9.3.4  Smbus Interface
      5. 9.3.5  Temperature Data Format
      6. 9.3.6  Open-Drain Outputs
      7. 9.3.7  Diode Fault Detection
      8. 9.3.8  Communicating With The LM89
        1. 9.3.8.1 SMBus Timing Diagrams
      9. 9.3.9  Serial Interface Reset
      10. 9.3.10 Digital Filter
      11. 9.3.11 Fault Queue
      12. 9.3.12 One-Shot Register
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-On-Default States
    5. 9.5 Programming
    6. 9.6 Register Maps
      1. 9.6.1  Command Register
      2. 9.6.2  Local And Remote Temperature Registers (LT, RTHB, RTLB)
      3. 9.6.3  Status Register (SR)
      4. 9.6.4  Configuration Register
      5. 9.6.5  Conversion Rate Register
      6. 9.6.6  Local And Remote High Setpoint Registers (LHS, RHSHB, And RHSLB)
      7. 9.6.7  Local And Remote Low Setpoint Registers (LLS, RLSHB, And RLSLB)
      8. 9.6.8  Remote Temperature Offset Registers (RTOHB And RTOLB)
      9. 9.6.9  Local And Remote T_crit Registers (RCS And LCS)
      10. 9.6.10 T_CRIT Hysteresis Register (TH)
      11. 9.6.11 Filter And Alert Configure Register
      12. 9.6.12 Manufacturers Id Register
      13. 9.6.13 Die Revision Code Register
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Diode Nonideality
          1. 10.2.1.1.1 Diode Nonideality Factor Effect On Accuracy
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Compensating For Diode Nonideality
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT
Supply Voltage −0.3 6.0 V
Voltage at SMBData, SMBCLK, ALERT, T_CRIT_A −0.5 6.0 V
Voltage at Other Pins −0.3 (VDD + 0.3 V) V
D− Input Current -1 +1 mA
Input Current at All Other Pins(3) -5 +5 mA
Package Input Current(3) 30 mA
SMBData, ALERT, T_CRIT_A Output Sink Current 10 mA
Junction Temperature 150 °C
Soldering Information, Lead Temperature
SOIC or VSSOP Packages(4)		 Vapor Phase (60 seconds) 215 °C
Infrared (15 seconds) 220 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions.
(2) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA. Parasitic components and or ESD protection circuitry are shown in Table 1 and Figure 1 for the LM89's pins. The nominal breakdown voltage of D3 is 6.5 V. Care should be taken not to forward bias the parasitic diode, D1, present on pins: D+, D−. Forward biasing the parasitic diode by more than 50 mV may corrupt a temperature measurements.
(4) Visit www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

8.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range -65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) -2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins; Applies only to LM89-1DiMM(2) -1000 1000
Machine model ESD stress voltage, per JEDEC specification JESD22-A115.(3) -200 200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) The machine model is a 200pF capacitor discharged directly into each pin.

8.3 Recommended Operating Conditions

MIN MAX UNIT
Operating Temperature Range 0 125 °C
Electrical Characteristics Temperature Range TMIN ≤ TA ≤ TMAX
  LM89 0°C ≤ TA ≤ +85°C
Supply Voltage Range (VDD) 3.0 3.6 V

8.4 Thermal Information

THERMAL METRIC(1) LM89 LM89 UNIT
VSSOP SOIC
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 158 116 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 52 63
RθJB Junction-to-board thermal resistance 78 57
ψJT Junction-to-top characterization parameter 5 11
ψJB Junction-to-board characterization parameter 77 57
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

8.5 Temperature-To-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for VDD= +3.0Vdc to 3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
Temperature Error Using Local Diode TA = +25°C to +125°C, (3) -3 ±1 3 °C
Temperature Error Using Remote Diode of 0.13 micron Pentium 4 or other devices with typical nonideality of 1.0021 and series R= 3.64Ω. TA = +30°C TDiode = +80°C -0.75 0.75 °C
TA = +30°C to +50°C TDiode = +60°C to +100°C -1 1 °C
TA = +0°C to +85°C TDiode = +25°C to +125°C -3 3 °C
Remote Diode Measurement Resolution 11 Bits
0.125 °C
Local Diode Measurement Resolution 8 Bits
1 °C
Quiescent Current (1) SMBus Inactive, 16Hz conversion rate 0.8 1.7 mA
Shutdown 315 µA
D− Source Voltage 0.7 V
Diode Source Current (D+ − D−) = +0.65V; high level 110 160 315 µA
Low level 7 13 20 µA
ALERT and T_CRIT_A Output Saturation Voltage IOUT = 6.0 mA 0.4 V
Power-On Reset Threshold Measure on VDD input, falling edge 1.8 2.4 V
Local and Remote HIGH Default Temperature settings  (4) 70 °C
Local and Remote LOW Default Temperature settings  (4) 0 °C
Local T_CRIT Default Temperature Setting for LM89-1C and LM89C  (4) 85 °C
Local T_CRIT Default Temperature Setting for LM89-1D (4) 105 °C
Remote T_CRIT Default Temperature Setting  (4) 110 °C
(1) Limits are ensured to AOQL (Average Outgoing Quality Level).
(2) Typical values are at TA = 25°C and represent most likely parametric norm.
(3) Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM89 and the thermal resistance. See Thermal Information for the thermal resistance to be used in the self-heating calculation.
(4) Default values set at power up.

8.6 Digital DC Characteristics

Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to 3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C.
SYMBOL PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SMBData, SMBCLK INPUTS
VIN(1) Logical “1” Input Voltage 2.1 V
VIN(0) Logical “0”Input Voltage 0.8 V
VIN(HYST) SMBData and SMBCLK Digital Input Hysteresis 400 mV
IIN(1) Logical “1” Input Current VIN = VDD 0.005 10 µA
IIN(0) Logical “0” Input Current VIN = 0 V -10 −0.005 µA
CIN Input Capacitance 5 pF
ALL DIGITAL OUTPUTS
IOH High Level Output Current VOH = VDD 10 µA
VOL SMBus Low Level Output Voltage IOL = 4mA
IOL = 6mA 		0.4
0.6 		V
(1) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(2) Typical values are at TA = 25°C and represent most likely parametric norm.

8.7 Timing Requirements

Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to +3.6Vdc. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C.
PARAMETER MIN(1) TYP(2) MAX(1) UNIT
Conversion Time of All Temperatures at the Fastest Setting (3) 31.25 34.4 ms
(1) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(2) Typical values are at TA = 25°C and represent most likely parametric norm.
(3) This specification is provided only to indicate how often temperature data is updated. The LM89 can be read at any time without regard to conversion state (and will yield last conversion result)

8.8 SMBus Digital Switching Characteristics

Unless otherwise noted, these specifications apply for VDD = +3.0Vdc to +3.6Vdc, CL (load capacitance) on output lines = 80 pF. Unless otherwise noted, MIN and MAX limits apply for TA = TJ = TMIN to TMAX and typical limits TA= TJ= +25°C.
The switching characteristics of the LM89 fully meet or exceed the published specifications of the SMBus version 2.0. The following parameters are the timing relationships between SMBCLK and SMBData signals related to the LM89. They adhere to but are not necessarily the SMBus bus specifications.
SYMBOL PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) Unit
fSMB SMBus Clock Frequency 10 100 kHz
tLOW SMBus Clock Low Time from VIN(0)max to VIN(0)max 4.7 25,000 µs
tHIGH SMBus Clock High Time from VIN(1)min to VIN(1)min 4.0 µs
tR,SMB SMBus Rise Time  (3) 1 µs
tF,SMB SMBus Fall Time  (4) 0.3 µs
tOF Output Fall Time CL = 400pF,
IO = 3mA, (4)		 250 ns
tTIMEOUT SMBData and SMBCLK Time Low for Reset of Serial Interface (5) 25 35 ms
tSU;DAT Data In Setup Time to SMBCLK High 250 ns
tHD;DAT Data Out Stable after SMBCLK Low 300 900 ns
tHD;STA Start Condition SMBData Low to SMBCLK Low (Start condition hold before the first clock falling edge) 100 ns
tSU;STO Stop Condition SMBCLK High to SMBData Low (Stop Condition Setup) 100 ns
tSU;STA SMBus Repeated Start-Condition Setup Time, SMBCLK High to SMBData Low 0.6 µs
tBUF SMBus Free Time Between Stop and Start Conditions 1.3 µs
(1) Limits are specific to TI's AOQL (Average Outgoing Quality Level).
(2) Typical values are at TA = 25°C and represent most likely parametric norm.
(3) The output rise time is measured from (VIN(0)max + 0.15V) to (VIN(1)min − 0.15V).
(4) The output fall time is measured from (VIN(1)min - 0.15V) to (VIN(1)min + 0.15V).
(5) Holding the SMBData and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM89's SMBus state machine, therefore setting SMBData and SMBCLK pins to a high impedance state.
20041540_nis128.gifFigure 2. SMBus Communication

8.9 Typical Characteristics

20041539.gif
Figure 3. Conversion Rate Effect On Power Supply Current