SNIS207 December   2018 LM95071-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Temperature Monitor Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics - Digital DC Characteristics
    7. 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Up and Power Down
      2. 8.3.2 Temperature Data Format
      3. 8.3.3 Tight Accuracy, Fine Resolution and Low Noise
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode/Manufacturer ID
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Interface
      2. 8.5.2 Serial Bus Timing Diagrams
    6. 8.6 Register Maps
      1. 8.6.1 Internal Register Structure
        1. 8.6.1.1 Configuration Register
        2. 8.6.1.2 Temperature Register
        3. 8.6.1.3 Manufacturer/Device ID Register
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Community Resource
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.