SNIS207 December   2018 LM95071-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Temperature Monitor Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Thermal Information
    5. 6.5 Temperature-to-Digital Converter Characteristics
    6. 6.6 Logic Electrical Characteristics - Digital DC Characteristics
    7. 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Up and Power Down
      2. 8.3.2 Temperature Data Format
      3. 8.3.3 Tight Accuracy, Fine Resolution and Low Noise
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode/Manufacturer ID
    5. 8.5 Programming
      1. 8.5.1 Serial Bus Interface
      2. 8.5.2 Serial Bus Timing Diagrams
    6. 8.6 Register Maps
      1. 8.6.1 Internal Register Structure
        1. 8.6.1.1 Configuration Register
        2. 8.6.1.2 Temperature Register
        3. 8.6.1.3 Manufacturer/Device ID Register
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Community Resource
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LM95071-Q1 UNIT
DBV (SOT-23)
5 PINS
RθJA Junction-to-ambient thermal resistance 167.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 118.8 °C/W
RθJB Junction-to-board thermal resistance 30.7 °C/W
ψJT Junction-to-top characterization parameter 14.4 °C/W
ψJB Junction-to-board characterization parameter 30.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.