SNOS724F August   2000  – February 2024 LMC6492 , LMC6494

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Input Common-Mode Voltage Range
      2. 6.1.2 Rail-to-Rail Output
      3. 6.1.3 Compensating for Input Capacitance
      4. 6.1.4 Capacitive Load Tolerance
    2. 6.2 Typical Application
      1. 6.2.1 Application Circuits
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout For High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Spice Macromodel
        2. 7.1.1.2 PSpice® for TI
        3. 7.1.1.3 TINA-TI™ Simulation Software (Free Download)
        4. 7.1.1.4 DIP-Adapter-EVM
        5. 7.1.1.5 DIYAMP-EVM
        6. 7.1.1.6 TI Reference Designs
        7. 7.1.1.7 Filter Design Tool
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4.     Trademarks
    5. 7.4 Electrostatic Discharge Caution
    6. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Revision History

Changes from Revision E (November 2023) to Revision F (February 2024)

  • Added data to Thermal Information Go
  • Updated footnote (2) to detail how slew rate minimum value is specified in Electrical Characteristics Go

Changes from Revision D (March 2013) to Revision E (November 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Pin Configuration and Functions, Specifications, ESD Ratings, Thermal Information, Application and Implementation, Application Information, Typical Applications, Layout, Layout Guidelines, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Updated Features Go
  • Deleted P (PDIP) packages from data sheetGo
  • Updated application circuit in Description Go
  • Moved ESD tolerance value from Absolute Maximum Ratings to ESD Ratings Go
  • Updated note 1 of Absolute Maximum Ratings Go
  • Changed Operating Conditions to Recommended Operating Conditions and deleted redundant table noteGo
  • Moved thermal information values from Operating Conditions to Thermal Information Go
  • Updated format of Electrical Characteristics Go
  • Deleted table notes 1, 2, and 3 from Electrical Characteristics to be consistent with standard TI data sheetsGo
  • Added ± to input offset voltage, input offset voltage drift, input bias current, and input offset current in Electrical Characteristics Go
  • Updated parameter names to be consistent with modern data sheetsGo
  • Moved the AC Electrical Characteristics and DC  Electrical Characteristics to Electrical Characteristics Go
  • Changed supply current specification from total to per amplifier in Electrical Characteristics Go
  • Deleted Figures 13 to 15, Figures 21 to 25, Figures 34 to 35, and Figures 51 to 54Go
  • Added Input Offset Voltage vs Common-Mode Voltage plot in Amplifier Topology and related description Go
  • Updated description of Rail-to-Rail Output Go

Changes from Revision C (March 2013) to Revision D (March 2013)

  • Changed layout of National Data Sheet to TI formatGo