SNOSC51D March   1998  – February 2024 LMC660 , LMC662

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information LMC662
    5. 5.5 Thermal Information LMC660
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating Input Capacitance
      3. 6.1.3 Capacitive Load Tolerance
      4. 6.1.4 Bias Current Testing
    2. 6.2 Typical Applications
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout for High-Impedance Work
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3.     Trademarks
    4. 7.3 Electrostatic Discharge Caution
    5. 7.4 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage ±Supply Voltage V
Supply voltage, VS = (V+) – (V–) Single supply 0 16 V
Dual supply ±8
Signal input pins Voltage (V–) – 0.3 (V+) + 0.3 V
Current ±5 mA
Output pin current ±18 mA
Output short circuit To V+ See(3)
To V– See(4)
Power supply pin Current 35 mA
Power dissipation See(5)
Temperature Operating, TA –40 150 °C
Junction, TJ 150
Storage, Tstg –65 150
Lead (soldering, 10 sec.) 260
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Do not connect output to V+ when V+ is greater than 13V or reliability will be adversely affected.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely affect reliability.
(5) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) – TA) / θJA