SNOSDE2A October   2022  – December 2022 LMG2610

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 GaN Power FET Switching Parameters
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  GaN Power FET Switching Capability
      2. 8.3.2  Turn-On Slew-Rate Control
      3. 8.3.3  Current-Sense Emulation
      4. 8.3.4  Bootstrap Diode Function
      5. 8.3.5  Input Control Pins (EN, INL, INH)
      6. 8.3.6  INL - INH Interlock
      7. 8.3.7  AUX Supply Pin
        1. 8.3.7.1 AUX Power-On Reset
        2. 8.3.7.2 AUX Under-Voltage Lockout (UVLO)
      8. 8.3.8  BST Supply Pin
        1. 8.3.8.1 BST Power-On Reset
        2. 8.3.8.2 BST Under-Voltage Lockout (UVLO)
      9. 8.3.9  Over-Current Protection
      10. 8.3.10 Over-Temperature Protection
      11. 8.3.11 Fault Reporting
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Turn-On Slew-Rate Design
        2. 9.2.2.2 Current-Sense Design
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Solder-Joint Stress Relief
        2. 9.4.1.2 Signal-Ground Connection
        3. 9.4.1.3 CS Pin Signal
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RRG|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Typical Characteristics



Figure 6-1 Low-Side Normalized On-Resistance vs Junction Temperature


Figure 6-3 Low-Side Output Capacitance vs Drain-Source Voltage


Figure 6-5 High-Side Output Capacitance vs Drain-Source Voltage


Figure 6-7 Low-Side Drain Current Turn-On Delay Time vs Junction Temperature


Figure 6-9 Low-Side Turn-On Rise Time vs Junction Temperature


Figure 6-11 Low-Side Turn-Off Delay Time vs Junction Temperature


Figure 6-13 High-Side Turn-On Delay Time vs Junction Temperature


Figure 6-15 High-Side Turn-On Slew Rate vs Junction Temperature


Figure 6-17 AUX Standby Current vs Junction Temperature


INL = 5 V
Figure 6-19 AUX Quiescent Current vs Junction Temperature


INH = 0 V
Figure 6-21 BST Quiescent Current vs Junction Temperature


Figure 6-23 BST Operating Current vs Junction Temperature


Figure 6-2 High-Side Normalized On-Resistance vs Junction Temperature


Figure 6-4 Low-Side Output Capacitance Stored Energy vs Drain-Source Voltage


Figure 6-6 High-Side Output Capacitance Stored Energy vs Drain-Source Voltage


Figure 6-8 Low-Side Turn-On Delay Time vs Junction Temperature


Figure 6-10 Low-Side Turn-On Slew Rate vs Junction Temperature


Figure 6-12 High-Side Drain Current Turn-On Delay Time vs Junction Temperature


Figure 6-14 High-Side Turn-On Rise Time vs Junction Temperature


Figure 6-16 High-Side Turn-Off Delay Time vs Junction Temperature


INL = 0 V
Figure 6-18 AUX Quiescent Current vs Junction Temperature


Figure 6-20 AUX Operating Current vs Frequency


INH = 5 V
Figure 6-22 BST Quiescent Current vs Junction Temperature