SNOSDH5 November   2024 LMG2640

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 GaN Power FET Switching Parameters
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN Power FET Switching Capability
      2. 7.3.2  Current-Sense Emulation
      3. 7.3.3  Bootstrap Diode Function
      4. 7.3.4  Input Control Pins (EN, INL, INH)
      5. 7.3.5  INL - INH Interlock
      6. 7.3.6  AUX Supply Pin
        1. 7.3.6.1 AUX Power-On Reset
        2. 7.3.6.2 AUX Under-Voltage Lockout (UVLO)
      7. 7.3.7  BST Supply Pin
        1. 7.3.7.1 BST Power-On Reset
        2. 7.3.7.2 BST Under-Voltage Lockout (UVLO)
      8. 7.3.8  Over-Current Protection
      9. 7.3.9  Over-Temperature Protection
      10. 7.3.10 Fault Reporting
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Stress Relief
        2. 8.4.1.2 Signal-Ground Connection
        3. 8.4.1.3 CS Pin Signal
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRG|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Typical Characteristics


LMG2640 Low-Side Normalized On-Resistance vs Junction Temperature

Figure 5-1 Low-Side Normalized On-Resistance vs Junction Temperature

LMG2640 Low-Side Output Capacitance vs Drain-Source Voltage

Figure 5-3 Low-Side Output Capacitance vs Drain-Source Voltage

LMG2640 High-Side Output Capacitance vs Drain-Source Voltage

Figure 5-5 High-Side Output Capacitance vs Drain-Source Voltage

LMG2640 Low-Side Drain Current Turn-On Delay Time vs Junction Temperature

Figure 5-7 Low-Side Drain Current Turn-On Delay Time vs Junction Temperature

LMG2640 Low-Side Turn-On Rise Time vs Junction Temperature

Figure 5-9 Low-Side Turn-On Rise Time vs Junction Temperature

LMG2640 Low-Side Turn-Off Delay Time vs Junction Temperature

Figure 5-11 Low-Side Turn-Off Delay Time vs Junction Temperature

LMG2640 High-Side Turn-On Delay Time vs Junction Temperature

Figure 5-13 High-Side Turn-On Delay Time vs Junction Temperature

LMG2640 High-Side Turn-On Slew Rate vs Junction Temperature

Figure 5-15 High-Side Turn-On Slew Rate vs Junction Temperature

LMG2640 AUX Standby Current vs Junction Temperature

Figure 5-17 AUX Standby Current vs Junction Temperature

LMG2640 AUX Quiescent Current vs Junction Temperature

INL = 5V
Figure 5-19 AUX Quiescent Current vs Junction Temperature

LMG2640 BST Quiescent Current vs Junction Temperature

INH = 0V
Figure 5-21 BST Quiescent Current vs Junction Temperature

LMG2640 BST Operating Current vs Frequency

Figure 5-23 BST Operating Current vs Frequency

LMG2640 High-Side Normalized On-Resistance vs Junction Temperature

Figure 5-2 High-Side Normalized On-Resistance vs Junction Temperature

LMG2640 Low-Side Output Capacitance Stored Energy vs Drain-Source Voltage

Figure 5-4 Low-Side Output Capacitance Stored Energy vs Drain-Source Voltage

LMG2640 High-Side Output Capacitance Stored Energy vs Drain-Source Voltage

Figure 5-6 High-Side Output Capacitance Stored Energy vs Drain-Source Voltage

LMG2640 Low-Side Turn-On Delay Time vs Junction Temperature

Figure 5-8 Low-Side Turn-On Delay Time vs Junction Temperature

LMG2640 Low-Side Turn-On Slew Rate vs Junction Temperature

Figure 5-10 Low-Side Turn-On Slew Rate vs Junction Temperature

LMG2640 High-Side Drain Current Turn-On Delay Time vs Junction Temperature

Figure 5-12 High-Side Drain Current Turn-On Delay Time vs Junction Temperature

LMG2640 High-Side Turn-On Rise Time vs Junction Temperature

Figure 5-14 High-Side Turn-On Rise Time vs Junction Temperature

LMG2640 High-Side Turn-Off Delay Time vs Junction Temperature

Figure 5-16 High-Side Turn-Off Delay Time vs Junction Temperature

LMG2640 AUX Quiescent Current vs Junction Temperature

INL = 0V
Figure 5-18 AUX Quiescent Current vs Junction Temperature

LMG2640 AUX Operating Current vs Frequency

Figure 5-20 AUX Operating Current vs Frequency

LMG2640 BST Quiescent Current vs Junction Temperature

INH = 5V
Figure 5-22 BST Quiescent Current vs Junction Temperature