SNOSDH5 November   2024 LMG2640

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 GaN Power FET Switching Parameters
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN Power FET Switching Capability
      2. 7.3.2  Current-Sense Emulation
      3. 7.3.3  Bootstrap Diode Function
      4. 7.3.4  Input Control Pins (EN, INL, INH)
      5. 7.3.5  INL - INH Interlock
      6. 7.3.6  AUX Supply Pin
        1. 7.3.6.1 AUX Power-On Reset
        2. 7.3.6.2 AUX Under-Voltage Lockout (UVLO)
      7. 7.3.7  BST Supply Pin
        1. 7.3.7.1 BST Power-On Reset
        2. 7.3.7.2 BST Under-Voltage Lockout (UVLO)
      8. 7.3.8  Over-Current Protection
      9. 7.3.9  Over-Temperature Protection
      10. 7.3.10 Fault Reporting
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Stress Relief
        2. 8.4.1.2 Signal-Ground Connection
        3. 8.4.1.3 CS Pin Signal
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRG|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Application Information

The LMG2640 is a GaN power-FET half bridge with plug-and-play simplicity since it integrates the half-bridge FETs, FET gate drivers, high-side gate-drive level shifter, bootstrap diode function, and current-sense emulation in a single package. The integrated gate driver, low IN input threshold voltage, and wide AUX input-supply voltage allows the LMG2640 to seamlessly pair with common industry power-supply controllers.