SLUSEY6A September   2023  – May 2024 LMG3522R050 , LMG3526R050

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switching Parameters
      1. 6.1.1 Turn-On Times
      2. 6.1.2 Turn-Off Times
      3. 6.1.3 Drain-Source Turn-On Slew Rate
      4. 6.1.4 Zero-Voltage Detection Times
    2. 6.2 Safe Operation Area (SOA)
      1. 6.2.1 Repetitive SOA
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 LMG3522R050 Functional Block Diagram
      2. 7.2.2 LMG3526R050 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN FET Operation Definitions
      2. 7.3.2  Direct-Drive GaN Architecture
      3. 7.3.3  Drain-Source Voltage Capability
      4. 7.3.4  Internal Buck-Boost DC-DC Converter
      5. 7.3.5  VDD Bias Supply
      6. 7.3.6  Auxiliary LDO
      7. 7.3.7  Fault Protection
        1. 7.3.7.1 Overcurrent Protection and Short-Circuit Protection
        2. 7.3.7.2 Overtemperature Shutdown Protection
        3. 7.3.7.3 UVLO Protection
        4. 7.3.7.4 High-Impedance RDRV Pin Protection
        5. 7.3.7.5 Fault Reporting
      8. 7.3.8  Drive-Strength Adjustment
      9. 7.3.9  Temperature-Sensing Output
      10. 7.3.10 Ideal-Diode Mode Operation
        1. 7.3.10.1 Overtemperature-Shutdown Ideal-Diode Mode
      11. 7.3.11 Zero-Voltage Detection (ZVD)
    4. 7.4 Start-Up Sequence
    5. 7.5 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Slew Rate Selection
          1. 8.2.2.1.1 Start-Up and Slew Rate With Bootstrap High-Side Supply
        2. 8.2.2.2 Signal Level-Shifting
        3. 8.2.2.3 Buck-Boost Converter Design
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Using an Isolated Power Supply
      2. 8.4.2 Using a Bootstrap Diode
        1. 8.4.2.1 Diode Selection
        2. 8.4.2.2 Managing the Bootstrap Voltage
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Solder-Joint Reliability
        2. 8.5.1.2 Power-Loop Inductance
        3. 8.5.1.3 Signal-Ground Connection
        4. 8.5.1.4 Bypass Capacitors
        5. 8.5.1.5 Switch-Node Capacitance
        6. 8.5.1.6 Signal Integrity
        7. 8.5.1.7 High-Voltage Spacing
        8. 8.5.1.8 Thermal Recommendations
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Export Control Notice
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Typical Characteristics

LMG3522R050 LMG3526R050 Drain-Current Turn-On Delay Time vs Drive-Strength ResistanceFigure 5-1 Drain-Current Turn-On Delay Time vs Drive-Strength Resistance
LMG3522R050 LMG3526R050 Turn-On Rise Time vs Drive-Strength ResistanceFigure 5-3 Turn-On Rise Time vs Drive-Strength Resistance
LMG3522R050 LMG3526R050 Drain Current vs Drain-Source Voltage
 
Figure 5-5 Drain Current vs Drain-Source Voltage
LMG3522R050 LMG3526R050 Normalized On-Resistance vs Junction TemperatureFigure 5-7 Normalized On-Resistance vs Junction Temperature
LMG3522R050 LMG3526R050 VDD Supply Current vs IN Switching Frequency
VDD = 12V TJ = 25°C
Figure 5-9 VDD Supply Current vs IN Switching Frequency
LMG3522R050 LMG3526R050 Repetitive Safe Operation AreaFigure 5-11 Repetitive Safe Operation Area
LMG3522R050 LMG3526R050 Turn-On Delay Time vs Drive-Strength ResistanceFigure 5-2 Turn-On Delay Time vs Drive-Strength Resistance
LMG3522R050 LMG3526R050 Turn-On Slew Rate vs Drive-Strength ResistanceFigure 5-4 Turn-On Slew Rate vs Drive-Strength Resistance
LMG3522R050 LMG3526R050 Off-State Source-Drain Voltage vs Source Current
IN = 0V
Figure 5-6 Off-State Source-Drain Voltage vs Source Current
LMG3522R050 LMG3526R050 Output Capacitance vs Drain-Source VoltageFigure 5-8 Output Capacitance vs Drain-Source Voltage
LMG3522R050 LMG3526R050 VDD Supply Current vs IN Switching Frequency
VDD = 12V TJ = 125°C
Figure 5-10 VDD Supply Current vs IN Switching Frequency
LMG3522R050 LMG3526R050 ZVD Third Quadrant Conduction Time vs Drive-Strength ResistanceFigure 5-12 ZVD Third Quadrant Conduction Time vs Drive-Strength Resistance