SNOSDL1 December   2024 LMG3650R035

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Switching Parameters
      1. 7.1.1 Turn-On Times
      2. 7.1.2 Turn-Off Times
      3. 7.1.3 Drain-Source Turn-On and Turn-off Slew Rate
      4. 7.1.4 Zero-Voltage Detection Times (LMG3656R035 only)
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 LMG3650R035 Functional Block Diagram
      2. 8.2.2 LMG3651R035 Functional Block Diagram
      3. 8.2.3 LMG3656R035 Functional Block Diagram
      4. 8.2.4 LMG3657R035 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Drive Strength Adjustment
      2. 8.3.2 VDD Supply
      3. 8.3.3 Overcurrent and Short-Circuit Protection
      4. 8.3.4 Overtemperature Protection
      5. 8.3.5 UVLO Protection
      6. 8.3.6 Fault Reporting
      7. 8.3.7 Auxiliary LDO (LMG3651R035 Only)
      8. 8.3.8 Zero-Voltage Detection (ZVD) (LMG3656R035 Only)
      9. 8.3.9 Zero-Current Detection (ZCD) (LMG3657R035 Only)
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Slew Rate Selection
        2. 9.2.2.2 Signal Level-Shifting
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Using an Isolated Power Supply
      2. 9.3.2 Using a Bootstrap Diode
        1. 9.3.2.1 Diode Selection
        2. 9.3.2.2 Managing the Bootstrap Voltage
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • KLA|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 LMG3650R035, TOLL Package (Top View)
Figure 5-3 LMG3656R035, TOLL Package (Top View)
Figure 5-2 LMG3651R035, TOLL Package (Top View)
Figure 5-4 LMG3657R035, TOLL Package (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME LMG3650R035 LMG3651R035 LMG3656R035 LMG3657R035
SRC 1 - 4 1 - 4 1 - 4 1 - 4 P GaN FET source.
FLT/RDRV 5 5 5 5 O, I Fault monitoring and drive strength selection pin. Connect a resistor from this pin to GND to set the turn-on drive strength. Connect a resistor in series with capacitor from this pin to GND to set the turn-off drive strength. Slew rates are set one time at the time of power up, then the pin is used for fault monitoring.
VDD 6 6 6 6 P Device input supply
GND 7 — — — G Signal ground. Internally connected to SRC, and THERMAL PAD.
LDO5V — 7 — — P 5V LDO output for external digital isolator.
ZVD — — 7 — O Push-pull digital output that provides zero-voltage detection signal to indicate if device achieves zero-voltage switching in current switching cycle.
ZCD — — — 7 O Push-pull digital output that sets ZCD pin high when the drain-to-source current is negative and transitions to low upon detecting the zero-crossing point.
IN 8 8 8 8 I CMOS compatible non inverting input used to turn the FET on and off
DRN 9 9 9 9 P GaN FET drain
THERMAL PAD — — — — — Thermal pad.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.