SNOSDL9 December   2024 LMG5126

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Configuration
      2. 6.3.2 Switching Frequency and Synchronization (SYNCIN)
      3. 6.3.3 Dual Random Spread Spectrum (DRSS)
      4. 6.3.4 Operation Modes (BYPASS, DEM, FPWM)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown State
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Feedback Compensation
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Determining the Duty Cycle
        2. 7.2.3.2 Timing Resistor RT
        3. 7.2.3.3 Vout Programming
        4. 7.2.3.4 Inductor Selection Lm
        5. 7.2.3.5 Output Capacitor Cout
      4. 7.2.4 Application Curves
        1. 7.2.4.1 Efficiency
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Tape and Reel Information
    3. 10.3 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
  • VBT|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

Over the recommended operating junction temperature range (unless otherwise specified)(1)
MIN NOM MAX UNIT
VI Boost Input Voltage (when BIAS ≥ 6.5V or VOUT ≥ 6V ) 2.5 42 V
VOUT Boost Output Voltage 6 60 V
VBIAS BIAS Input Voltage 6.5 42 V
VUVLO/EN UVLO/EN Input Voltage 0 42 V
VMODE MODE Input Voltage 0 5.25 V
VCSA, VCSB Current Sense Input Voltage 2.5 42 V
VATRK ATRK Input Voltage 0.2 2 V
VDTRK DTRK Input Voltage 0 5.25 V
VDLY DLY Voltage 0 5.25 V
VPGOOD PGOOD Voltage 0 5.25 V
VIMON/ILIM IMON/ILIM Voltage 0 5.25 V
VSYNCIN Synchronization Pulse Input Voltage 0 5.25 V
fSW Switching Frequency Range 300 2500(2) kHz
fSYNCIN Synchronization Pulse Frequency Range 300 2500(2) kHz
fDTRK DTRK Frequency Range 100 2200 kHz
TJ Operating Junction Temperature –40 150(3) °C
(1) Operating Ratings are conditions under the device is intended to be functional. For specifications and test conditions, see Section 5.5
(2) Maximum switching frequency is programmed by RRT. The device supports up to 2200kHz switching.  
(3) High junction temperatures degrade operating lifetimes. Operating lifetime is de-rated for junction temperatures greater than 125°C.