SBOSA33A September   2021  – December 2021 LMH5485-SP

ADVANCE INFORMATION  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: VS+ – VS– = 5 V
    6. 7.6  Electrical Characteristics: VS+ – VS– = 3 V
    7. 7.7  Quality Conformance Inspection
    8. 7.8  Typical Characteristics: 5 V Single Supply
    9. 7.9  Typical Characteristics: 3 V Single Supply
    10. 7.10 Typical Characteristics: 3 V to 5 V Supply Range
  8. 8 Parameter Measurement Information
    1. 8.1 Example Characterization Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Terminology and Application Assumptions
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential I/O
      2. 9.3.2 Power-Down Control Pin (PD)
        1. 9.3.2.1 Operating the Power Shutdown Feature
      3. 9.3.3 Input Overdrive Operation
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation from Single-Ended Sources to Differential Outputs
        1. 9.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 9.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversion
        3. 9.4.1.3 Resistor Design Equations for the Single-Ended to Differential Configuration of the FDA
        4. 9.4.1.4 Input Impedance for the Single-Ended to Differential FDA Configuration
      2. 9.4.2 Differential-Input to Differential-Output Operation
        1. 9.4.2.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tube Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HKX|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) LMH5485-SP UNIT
HKX (CFP)
8 PINS
RθJA Junction-to-ambient thermal resistance 145.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 °C/W
RθJB Junction-to-board thermal resistance 128.1 °C/W
ψJT Junction-to-top characterization parameter 61.1 °C/W
ψJB Junction-to-board characterization parameter 122.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 55.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.