SNOSB30P October   2008  – January 2015 LMH6554

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: +5 V
    6. 7.6 Typical Performance Characteristics VS = ±2.5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Ended Input to Differential Output Operation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Enable / Disable Operation
          2. 9.2.1.2.2 Single-Ended Input to Differential Output Operation
          3. 9.2.1.2.3 Driving Capacitive Loads
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fully Differential Operation
      3. 9.2.3 Single Supply Operation
      4. 9.2.4 Driving Analog-to-Digital Converters
      5. 9.2.5 Output Noise Performance and Measurement
      6. 9.2.6 Balanced Cable Driver
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Bypassing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 ESD Protection
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings (1)(2)(4)

MIN MAX UNIT
Supply Voltage (VS = V+ - V−) 5.5 V
Common Mode Input Voltage V- V+ V
Maximum Operating Junction Temperature 150 °C
Maximum Input Current 30 mA
Maximum Output Current (pins 12, 13)  (3) mA
Soldering Information 260 °C
Infrared or Convection (30 sec)
Storage Temperature, Tstg −65 150 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics: +5 V tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) The maximum output current (IOUT) is determined by device power dissipation limitations. See Power Dissipation for more details.
(4) For soldering specifications, see SNOA549.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
Machine model (MM) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

See (1)
MIN NOM MAX UNIT
Operating Temperature Range −40 +125 °C
Total Supply Voltage Temperature Range 4.7 5.25 V

7.4 Thermal Information

THERMAL METRIC(1) LMH6554 UNIT
NHJ
14 PINS
RθJA Junction-to-ambient thermal resistance 60 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics: +5 V

Unless otherwise specified, all limits are ensured for TA = +25°C, AV = +2, V+ = +2.5 V, V− = −2.5 V, RL = 200 Ω, VCM = (V++V-)/2, RF = 200 Ω, for single-ended in, differential out.(1)
PARAMETER TEST CONDITIONS MIN (4) TYP (3) MAX (4) UNIT
AC PERFORMANCE (DIFFERENTIAL)
SSBW Small Signal −3 dB Bandwidth (4) AV = 1, VOUT = 0.2 VPP 2800 MHz
AV = 2, VOUT = 0.2 VPP 2500
AV = 4, VOUT = 0.2 VPP 1600
LSBW Large Signal Bandwidth AV = 1, VOUT = 2 VPP 1800 MHz
AV = 2, VOUT = 2 VPP 1500
AV = 2, VOUT = 1.5 VPP 1900
0.1 dBBW 0.1 dB Bandwidth AV = 2, VOUT = 0.2 VPP, RF = 250Ω 830 MHz
SR Slew Rate 4V Step 6200 V/μs
tr/tf Rise/Fall Time 2V Step, 10–90% 290 ps
0.4V Step, 10–90% 150
Ts_0.1 0.1% Settling Time 2V Step, RL = 200Ω 4 ns
Overdrive Recovery Time VIN = 2V, AV = 5 V/V 6 ns
DISTORTION AND NOISE RESPONSE
HD2 2nd Harmonic Distortion VOUT = 2 VPP, f = 20 MHz -102 dBc
VOUT = 2 VPP, f = 75 MHz -96
VOUT = 2 VPP, f = 125 MHz -87
VOUT = 2 VPP, f = 250 MHz −79
VOUT = 1.5 VPP, f = 250 MHz −81
HD3 3rd Harmonic Distortion VOUT = 2 VPP, f = 20 MHz −110 dBc
VOUT = 2 VPP, f = 75 MHz −97
VOUT = 2 VPP, f = 125 MHz −87
VOUT = 2 VPP, f = 250 MHz −70
VOUT = 1.5 VPP, f = 250 MHz −75
OIP3 Output 3rd-Order Intercept f = 150 MHz, VOUT = 2VPP Composite 46.5 dBm
IMD3 Two-Tone Intermodulation f = 150 MHz, VOUT = 2VPP Composite −97 dBc
en Input Voltage Noise Density f = 10 MHz 0.9 nV/√Hz
in+ Input Noise Current f = 10 MHz 11 pA/√Hz
in- Input Noise Current f = 10 MHz 11 pA/√Hz
NF Noise Figure (8) 50Ω System, AV = 7.3, 100 MHz 7.7 dB
INPUT CHARACTERISTICS
IBI+ / IBI- −75 −29 20 µA
TCIbi Input Bias Current Temperature Drift 8 µA/°C
IBID Input Bias Current (6) VCM = 0V, VID = 0V,
IBOFFSET = (IB- - IB+)/2		 −10 1 10 μA
TCIbo Input Bias Current Diff Offset Temperature Drift (3) 0.006 µA/°C
CMRR Common Mode Rejection Ratio DC, VCM = 0V, VID = 0V 83 dB
RIN Differential Input Resistance Differential 19 Ω
CIN Differential Input Capacitance Differential 1 pF
CMVR Input Common Mode Voltage Range CMRR > 32 dB ±1.25 ±1.3 V
OUTPUT PERFORMANCE
Output Voltage Swing (3) Single-Ended Output ±1.35 ±1.42 V
IOUT Output Current (3) VOUT = 0V ±120 ±150 mA
ISC Short Circuit Current One Output Shorted to Ground
VIN = 2V Single-Ended (2)		 150 mA
Output Balance Error ΔVOUT Common Mode /ΔVOUT Differential, ΔVOD = 1V, f < 1 Mhz −64 dB
OUTPUT COMMON MODE CONTROL CIRCUIT
Common Mode Small Signal Bandwidth VIN+ = VIN− = 0V 500 MHz
Slew Rate VIN+ = VIN− = 0V 200 V/μs
VOSCM Input Offset Voltage Common Mode, VID = 0, VCM = 0V −16 −6.5 4 mV
IOSCM Input Offset Current  (5) 6 18 μA
Voltage Range ±1.18 ±1.25 V
CMRR Measure VOD, VID = 0V 82 dB
Input Resistance 180 kΩ
Gain ΔVOCM/ΔVCM 0.99 0.995 1.0 V/V
MISCELLANEOUS PERFORMANCE
ZT Open Loop Transimpedance Gain Differential 180 kΩ
PSRR Power Supply Rejection Ratio DC, ΔV+ = ΔV− = 1V 74 95 dB
IS Supply Current (3) RL = ∞ 46 52 57 mA
At extreme temperatures 60
Enable Voltage Threshold Single 5V Supply (7) 2.5 V
Disable Voltage Threshold Single 5V Supply (7) 2.5 V
Enable/Disable Time 15 ns
ISD Supply Current, Disabled Enable=0, Single 5-V supply 450 510 570 μA
At extreme temperatures 600
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. See Thermal Information for information on temperature de-rating of this device." Min/Max ratings are based on product characterization and simulation. Individual parameters are tested as noted.
(2) Short circuit current should be limited in duration to no more than 10 seconds. See Power Dissipation for more details.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(4) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods.
(5) Negative input current implies current flowing out of the device.
(6) IBI is referred to a differential output offset voltage by the following relationship: VOD(OFFSET) = IBI*2RF.
(7) VEN threshold is typically +/-0.3V centered around (V+ + V-) / 2 relative to ground.
(8) For test schematic, refer to Figure 34.

7.6 Typical Performance Characteristics VS = ±2.5 V

(TA = 25°C, RF = 200 Ω, RG = 90 Ω, RT = 76.8 Ω, RL = 200 Ω, AV = +2, for single ended in, differential out, unless specified).
30073251.gifFigure 1. Frequency Response vs RF
30073252.gifFigure 3. Frequency Response vs RL
30073253.gifFigure 5. 0.5 VPP Pulse Response Single-Ended Input
30073255.gifFigure 7. 4 VPP Pulse Response Single-Ended Input
30073233.gifFigure 9. Distortion vs Output Common Mode Voltage
30073235.gifFigure 11. Distortion vs Output Common Mode Voltage
30073249.gifFigure 13. OIP3 vs Output Power POUT
30073268.gifFigure 15. Noise Figure vs Frequency
30073237.gifFigure 17. Minimum VOUT vs IOUT
30073241.gifFigure 19. PSRR
30073243.gifFigure 21. Balance Error
30073297.gifFigure 23. Closed-Loop Output Impedance
30073211.gifFigure 2. Frequency Response vs Gain
30073213.gifFigure 4. Frequency Response vs Output Voltage (VOD)
30073254.gifFigure 6. 2 VPP Pulse Response Single-Ended Input
30073228.gifFigure 8. Distortion vs Frequency Single-Ended Input
30073234.gifFigure 10. Distortion vs Output Common Mode Voltage
30073248.gifFigure 12. 3rd Order Intermodulation Products vs VOUT
30073250.gifFigure 14. OIP3 vs Center Frequency
30073236.gifFigure 16. Maximum VOUT vs IOUT
30073240.gifFigure 18. Overdrive Recovery
30073242.gifFigure 20. CMRR
30073269.gifFigure 22. Open Loop Transimpedance
30073246.gifFigure 24. Differential S-Parameter Magnitude vs Frequency