SNAS573D January   2012  – September 2021 LMK01801

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Functional Configurations
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Serial MICROWIRE Timing Diagram
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Differential Voltage Measurement Terminology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  High-Speed Clock Inputs (CLKin0/CLKin0* and CLKin1/CLKin1*)
      2. 9.3.2  Clock Distribution
      3. 9.3.3  Small Divider (1 to 8)
      4. 9.3.4  Large Divider (1 to 1045)
      5. 9.3.5  CLKout Analog Delay
      6. 9.3.6  CLKout0 to CLKout11 Digital Delay
      7. 9.3.7  CLKout12 and CLKout13 Digital Delay
      8. 9.3.8  Programmable Outputs
      9. 9.3.9  Clock Output Synchronization
      10. 9.3.10 Default Clock Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Programmable Mode
      2. 9.4.2 Pin Control Mode
      3. 9.4.3 Inputs / Outputs
        1. 9.4.3.1 CLKin0 and CLKin1
      4. 9.4.4 Input and Output Dividers
      5. 9.4.5 Fixed Digital Delay
        1. 9.4.5.1 Fixed Digital Delay - Example
      6. 9.4.6 Clock Output Synchronization (SYNC)
        1. 9.4.6.1 Dynamically Programming Digital Delay
          1. 9.4.6.1.1 Relative Dynamic Digital Delay
          2. 9.4.6.1.2 Relative Dynamic Digital Delay - Example
    5. 9.5 Programming
      1. 9.5.1 Recommended Programming Sequence
        1. 9.5.1.1 Overview
    6. 9.6 Register Map
      1. 9.6.1 Default Device Register Settings After Power On/Reset
      2. 9.6.2 Register R0
        1. 9.6.2.1 RESET
        2. 9.6.2.2 POWERDOWN
        3. 9.6.2.3 CLKoutX_Y_PD
          1. 9.6.2.3.1 CLKinX_BUF_TYPE
          2. 9.6.2.3.2 CLKinX_DIV
          3. 9.6.2.3.3 CLKinX_MUX
      3. 9.6.3 Register R1 and R2
        1. 9.6.3.1 CLKoutX_TYPE
      4. 9.6.4 Register R3
        1. 9.6.4.1 CLKout12_13_ADLY
        2. 9.6.4.2 CLKout12_13_HS, Digital Delay Half Shift
        3. 9.6.4.3 SYNC1_QUAL
        4. 9.6.4.4 SYNCX_POL_INV
        5. 9.6.4.5 NO_SYNC_CLKoutX_Y
        6. 9.6.4.6 CLKoutX_Y_OFFSET_PD
        7. 9.6.4.7 SYNCX_FAST
        8. 9.6.4.8 SYNCX_AUTO
      5. 9.6.5 Register R4
        1. 9.6.5.1 CLKout12_13_DDLY, Clock Channel Digital Delay
      6. 9.6.6 Register R5
        1. 9.6.6.1 CLKout12_ADLY_SEL[13], CLKout13_ADLY_SEL[14], Select Analog Delay
        2. 9.6.6.2 CLKoutX_Y_DIV Clock Output Divide
      7. 9.6.7 Register 15
        1. 9.6.7.1 uWireLock
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Detailed Design Procedure
        1. 10.1.1.1 Driving CLKin Inputs
          1. 10.1.1.1.1 Driving CLKin Pins With a Differential Source
          2. 10.1.1.1.2 Driving CLKin Pins With a Single-Ended Source
        2. 10.1.1.2 Termination and Use of Clock Output (Drivers)
          1. 10.1.1.2.1 Termination for DC-Coupled Differential Operation
          2. 10.1.1.2.2 Termination for AC-Coupled Differential Operation
          3. 10.1.1.2.3 Termination for Single-Ended Operation
  11. 11Power Supply Recommendations
    1. 11.1 Current Consumption
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Pin Connection Recommendations
        1. 12.1.1.1 Vcc Pins and Decoupling
        2. 12.1.1.2 Unused clock outputs
        3. 12.1.1.3 Unused clock inputs
        4. 12.1.1.4 Unused GPIO (CLKoutTYPE_X)
        5. 12.1.1.5 Bias
        6. 12.1.1.6 In MICROWIRE Mode
    2. 12.2 Thermal Management
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (October 2019) to Revision D (September 2021)

  • Updated Delay column for Clock Output Configurations table.Go
  • Added Fixed Digital Delay note for Clock Output Configurations table.Go
  • Changed Absolute Maximum Ratings note 1Go
  • Added Fixed Digital Delay block for CLKout0 to CLKout11 in Functional Block Diagram Go
  • Changed content and renamed Large Divider (1 to 1045) section to CLKout0 to CLKout11 Digital Delay Go
  • Added CLKoutX_Y_OFFSET_PD description to the Fixed Digital Delay sectionGo
  • Added CLKoutX_Y_OFFSET_PD description to SYNC Timing sectionGo
  • Added CLKoutX_Y_OFFSET_PD to Figure 9-1 Go
  • Added CLKoutX_Y_OFFSET_PD to Figure 9-2 Go
  • Added CLKoutX_Y_OFFSET_PD to the Register Map tableGo
  • Added CLKoutX_Y_OFFSET_PD fields to the Default Device Register Settings tableGo
  • Added CLKoutX_Y_OFFSET_PD sectionGo

Changes from Revision B (January 2019) to Revision C (October 2019)

  • Changed Test/CLKoutTYPE_0 type from: I to: I/OGo
  • Added propagation delay parameter in the Electrical Characteristics table Go
  • Added note to Clock Output Synchronization (SYNC) sectionGo
  • Changed Clock Output Synchronization Using the SYNC1 Pin graphicGo
  • Changed the Relative Dynamic Digital Delay Programming Example, 2nd Adjust graphicGo
  • Changed divide value for 1 (0x01) in the CLKinX_DIV table from: 2 to: 1 Go
  • Changed CLKoutX_Y_Div, 2 Bits table title to: CLKoutX_Y_Div, 3 Bits Go
  • Added Unused GPIO (CLKoutTYPE_X) section Go

Changes from Revision A (April 2013) to Revision B (January 2019)

  • Added Device Information table Go
  • Changed Pin Control Mode Table for EN_PIN_CTRL = Low Go
  • Added SPI note for Pin Control Mode Tables.Go
  • Changed polarity for pins 4,5 and 9,10 to be correct.Go
  • Changed CLKinX_DIV condition to "2 to 8" from "1 to 8" for fCLKinX.Go
  • Deleted TCR because readback is not supported.Go
  • Added Device and Documentation Support section Go

Changes from Revision * (April 2013) to Revision A (April 2013)

  • Changed layout of National Data Sheet to TI formatGo