SNAS605AS March   2013  – May 2020 LMK04821 , LMK04826 , LMK04828

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
    1. 5.1 Device Configuration Information
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Typical Characteristics – Clock Output AC Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Charge Pump Current Specification Definitions
      1. 8.1.1 Charge Pump Output Current Magnitude Variation Vs. Charge Pump Output Voltage
      2. 8.1.2 Charge Pump Sink Current Vs. Charge Pump Output Source Current Mismatch
      3. 8.1.3 Charge Pump Output Current Magnitude Variation Vs. Ambient Temperature
    2. 8.2 Differential Voltage Measurement Terminology
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1  Jitter Cleaning
      2. 9.1.2  JEDEC JESD204B Support
      3. 9.1.3  Three PLL1 Redundant Reference Inputs
      4. 9.1.4  VCXO/Crystal Buffered Output
      5. 9.1.5  Frequency Holdover
      6. 9.1.6  PLL2 Integrated Loop Filter Poles
      7. 9.1.7  Internal VCOs
        1. 9.1.7.1 VCO1 Divider (LMK04821 only)
      8. 9.1.8  External VCO Mode
      9. 9.1.9  Clock Distribution
        1. 9.1.9.1 Device Clock Divider
        2. 9.1.9.2 SYSREF Clock Divider
        3. 9.1.9.3 Device Clock Delay
        4. 9.1.9.4 SYSREF Delay
        5. 9.1.9.5 Glitchless Half Step and Glitchless Analog Delay
        6. 9.1.9.6 Programmable Output Formats
        7. 9.1.9.7 Clock Output Synchronization
      10. 9.1.10 Zero-Delay
      11. 9.1.11 Status Pins
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 SYNC/SYSREF
      2. 9.3.2 JEDEC JESD204B
        1. 9.3.2.1 How To Enable SYSREF
          1. 9.3.2.1.1 Setup of SYSREF Example
          2. 9.3.2.1.2 SYSREF_CLR
        2. 9.3.2.2 SYSREF Modes
          1. 9.3.2.2.1 SYSREF Pulser
          2. 9.3.2.2.2 Continuous SYSREF
          3. 9.3.2.2.3 SYSREF Request
      3. 9.3.3 Digital Delay
        1. 9.3.3.1 Fixed Digital Delay
          1. 9.3.3.1.1 Fixed Digital Delay Example
        2. 9.3.3.2 Dynamic Digital Delay
        3. 9.3.3.3 Single and Multiple Dynamic Digital Delay Example
      4. 9.3.4 SYSREF to Device Clock Alignment
      5. 9.3.5 Input Clock Switching
        1. 9.3.5.1 Input Clock Switching - Manual Mode
        2. 9.3.5.2 Input Clock Switching - Pin Select Mode
        3. 9.3.5.3 Input Clock Switching - Automatic Mode
      6. 9.3.6 Digital Lock Detect
      7. 9.3.7 Holdover
        1. 9.3.7.1 Enable Holdover
          1. 9.3.7.1.1 Fixed (Manual) CPout1 Holdover Mode
          2. 9.3.7.1.2 Tracked CPout1 Holdover Mode
        2. 9.3.7.2 Entering Holdover
        3. 9.3.7.3 During Holdover
        4. 9.3.7.4 Exiting Holdover
        5. 9.3.7.5 Holdover Frequency Accuracy and DAC Performance
        6. 9.3.7.6 Holdover Mode - Automatic Exit of Holdover
    4. 9.4 Device Functional Modes
      1. 9.4.1 Dual PLL
      2. 9.4.2 Zero-Delay Dual PLL
      3. 9.4.3 Single-Loop Mode
      4. 9.4.4 Single-Loop Mode With External VCO
      5. 9.4.5 Distribution Mode
    5. 9.5 Programming
      1. 9.5.1 Recommended Programming Sequence
        1. 9.5.1.1 SPI LOCK
        2. 9.5.1.2 SYSREF_CLR
        3. 9.5.1.3 RESET Pin
    6. 9.6 Register Maps
      1. 9.6.1 Register Map for Device Programming
    7. 9.7 Device Register Descriptions
      1. 9.7.1 System Functions
        1. 9.7.1.1 RESET, SPI_3WIRE_DIS
        2. 9.7.1.2 POWERDOWN
        3. 9.7.1.3 ID_DEVICE_TYPE
        4. 9.7.1.4 ID_PROD[15:8], ID_PROD
        5. 9.7.1.5 ID_MASKREV
        6. 9.7.1.6 ID_VNDR[15:8], ID_VNDR
      2. 9.7.2 (0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
        1. 9.7.2.1 CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKoutX_DIV
        2. 9.7.2.2 DCLKoutX_DDLY_CNTH, DCLKoutX_DDLY_CNTL
        3. 9.7.2.3 DCLKoutX_ADLY, DCLKoutX_ADLY_MUX, DCLKout_MUX
        4. 9.7.2.4 DCLKoutX_HS, SDCLKoutY_MUX, SDCLKoutY_DDLY, SDCLKoutY_HS
        5. 9.7.2.5 SDCLKoutY_ADLY_EN, SDCLKoutY_ADLY
        6. 9.7.2.6 DCLKoutX_DDLY_PD, DCLKoutX_HSg_PD, DCLKout_ADLYg_PD, DCLKout_ADLY_PD, DCLKoutX_Y_PD, SDCLKoutY_DIS_MODE, SDCLKoutY_PD
        7. 9.7.2.7 SDCLKoutY_POL, SDCLKoutY_FMT, DCLKoutX_POL, DCLKoutX_FMT
      3. 9.7.3 SYSREF, SYNC, and Device Config
        1. 9.7.3.1  VCO_MUX, OSCout_MUX, OSCout_FMT
        2. 9.7.3.2  SYSREF_CLKin0_MUX, SYSREF_MUX
        3. 9.7.3.3  SYSREF_DIV[12:8], SYSREF_DIV[7:0]
        4. 9.7.3.4  SYSREF_DDLY[12:8], SYSREF_DDLY[7:0]
        5. 9.7.3.5  SYSREF_PULSE_CNT
        6. 9.7.3.6  PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
        7. 9.7.3.7  PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
        8. 9.7.3.8  DDLYdSYSREF_EN, DDLYdX_EN
        9. 9.7.3.9  DDLYd_STEP_CNT
        10. 9.7.3.10 SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
        11. 9.7.3.11 SYNC_DISSYSREF, SYNC_DISX
        12. 9.7.3.12 Fixed Registers (0x145, 0x171 - 0x172)
      4. 9.7.4 (0x146 - 0x149) CLKin Control
        1. 9.7.4.1 CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
        2. 9.7.4.2 CLKin_SEL_POL, CLKin_SEL_MODE, CLKin1_OUT_MUX, CLKin0_OUT_MUX
        3. 9.7.4.3 CLKin_SEL0_MUX, CLKin_SEL0_TYPE
        4. 9.7.4.4 SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
      5. 9.7.5 RESET_MUX, RESET_TYPE
      6. 9.7.6 (0x14B - 0x152) Holdover
        1. 9.7.6.1 LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
        2. 9.7.6.2 MAN_DAC[9:8], MAN_DAC[7:0]
        3. 9.7.6.3 DAC_TRIP_LOW
        4. 9.7.6.4 DAC_CLK_MULT, DAC_TRIP_HIGH
        5. 9.7.6.5 DAC_CLK_CNTR
        6. 9.7.6.6 CLKin_OVERRIDE, HOLDOVER_PLL1_DET, HOLDOVER_LOS_DET, HOLDOVER_VTUNE_DET, HOLDOVER_HITLESS_SWITCH, HOLDOVER_EN
        7. 9.7.6.7 HOLDOVER_DLD_CNT[13:8], HOLDOVER_DLD_CNT[7:0]
      7. 9.7.7 (0x153 - 0x15F) PLL1 Configuration
        1. 9.7.7.1 CLKin0_R[13:8], CLKin0_R[7:0]
        2. 9.7.7.2 CLKin1_R[13:8], CLKin1_R[7:0]
        3. 9.7.7.3 CLKin2_R[13:8], CLKin2_R[7:0]
        4. 9.7.7.4 PLL1_N
        5. 9.7.7.5 PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
        6. 9.7.7.6 PLL1_DLD_CNT[13:8], PLL1_DLD_CNT[7:0]
        7. 9.7.7.7 PLL1_R_DLY, PLL1_N_DLY
        8. 9.7.7.8 PLL1_LD_MUX, PLL1_LD_TYPE
      8. 9.7.8 (0x160 - 0x16E) PLL2 Configuration
        1. 9.7.8.1 PLL2_R[11:8], PLL2_R[7:0]
        2. 9.7.8.2 PLL2_P, OSCin_FREQ, PLL2_XTAL_EN, PLL2_REF_2X_EN
        3. 9.7.8.3 PLL2_N_CAL
        4. 9.7.8.4 PLL2_FCAL_DIS, PLL2_N
        5. 9.7.8.5 PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
        6. 9.7.8.6 SYSREF_REQ_EN, PLL2_DLD_CNT
        7. 9.7.8.7 PLL2_LF_R4, PLL2_LF_R3
        8. 9.7.8.8 PLL2_LF_C4, PLL2_LF_C3
        9. 9.7.8.9 PLL2_LD_MUX, PLL2_LD_TYPE
      9. 9.7.9 (0x16F - 0x1FFF) Misc Registers
        1. 9.7.9.1  PLL2_PRE_PD, PLL2_PD
        2. 9.7.9.2  VCO1_DIV
        3. 9.7.9.3  OPT_REG_1
        4. 9.7.9.4  OPT_REG_2
        5. 9.7.9.5  RB_PLL1_LD_LOST, RB_PLL1_LD, CLR_PLL1_LD_LOST
        6. 9.7.9.6  RB_PLL2_LD_LOST, RB_PLL2_LD, CLR_PLL2_LD_LOST
        7. 9.7.9.7  RB_DAC_VALUE(MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
        8. 9.7.9.8  RB_DAC_VALUE
        9. 9.7.9.9  RB_HOLDOVER
        10. 9.7.9.10 SPI_LOCK
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Lock Detect Frequency Accuracy
      1. 10.2.1 Minimum Lock Time Calculation Example
    3. 10.3 Driving CLKin and OSCin Inputs
      1. 10.3.1 Driving CLKin and OSCin Pins With a Differential Source
      2. 10.3.2 Driving CLKin and OSCin Pins With a Single-Ended Source
    4. 10.4 Output Termination and Biasing
      1. 10.4.1 LVPECL
      2. 10.4.2 LVDS/HSDS
    5. 10.5 Typical Applications
      1. 10.5.1 Design Example
        1. 10.5.1.1 Design Requirements
        2. 10.5.1.2 Detailed Design Procedure
          1. 10.5.1.2.1 Device Configuration and Simulation - PLLatinum Sim
          2. 10.5.1.2.2 Device Programming
        3. 10.5.1.3 Application Curves
    6. 10.6 System Examples
      1. 10.6.1 System Level Diagram
    7. 10.7 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Pin Connection Recommendations
      1. 11.1.1 VCC Pins and Decoupling
        1. 11.1.1.1 Clock Output Supplies
        2. 11.1.1.2 Low-Crosstalk Supplies
        3. 11.1.1.3 PLL2 Supplies
        4. 11.1.1.4 Clock Input Supplies
        5. 11.1.1.5 Unused Clock Inputs/Outputs
    2. 11.2 Current Consumption / Power Dissipation Calculations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Thermal Management
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 PLLatinum Sim
        2. 13.1.1.2 TICS Pro
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 Differential Voltage Measurement Terminology

The differential voltage of a differential signal can be described by two different definitions, which can cause confusion when reading data sheets or communicating with other engineers. This section addresses the measurement and description of a differential signal, so that the reader can understand and distinguish between the two different definitions.

The first definition used to describe a differential signal is the absolute value of the voltage potential between the inverting and non-inverting signal. The symbol for this first measurement is typically VID or VOD, depending on if an input or output voltage is being described.

The second definition used to describe a differential signal is to measure the potential of the non-inverting signal with respect to the inverting signal. The symbol for this second measurement is VSS, and is a calculated parameter. This signal does not exist in the IC with respect to ground; it only exists in reference to its differential pair. VSS can be measured directly by oscilloscopes with floating references; otherwise this value can be calculated as twice the value of VOD, as described in the first description.

Figure 8 illustrates the two different definitions side-by-side for inputs, and Figure 9 illustrates the two different definitions side-by-side for outputs. The VID and VOD definitions show VA and VB DC levels that the non-inverting and inverting signals toggle between with respect to ground. VSS input and output definitions show that if the inverting signal is considered the voltage potential reference, the non-inverting signal voltage potential is now increasing and decreasing above and below the non-inverting reference. Thus, the peak-to-peak voltage of the differential signal can be measured.

VID and VOD are often defined as volts (V) and VSS is often defined as volts peak-to-peak (VPP).

LMK04821 LMK04826 LMK04828 30189075.gifFigure 8. Two Different Definitions for
Differential Input Signals
LMK04821 LMK04826 LMK04828 30189074.gifFigure 9. Two Different Definitions for
Differential Output Signals

Refer to application note AN-912 Common Data Transmission Parameters and their Definitions (SNLA036) for more information.