SNAS605AS March   2013  – May 2020 LMK04821 , LMK04826 , LMK04828

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
    1. 5.1 Device Configuration Information
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Typical Characteristics – Clock Output AC Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Charge Pump Current Specification Definitions
      1. 8.1.1 Charge Pump Output Current Magnitude Variation Vs. Charge Pump Output Voltage
      2. 8.1.2 Charge Pump Sink Current Vs. Charge Pump Output Source Current Mismatch
      3. 8.1.3 Charge Pump Output Current Magnitude Variation Vs. Ambient Temperature
    2. 8.2 Differential Voltage Measurement Terminology
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1  Jitter Cleaning
      2. 9.1.2  JEDEC JESD204B Support
      3. 9.1.3  Three PLL1 Redundant Reference Inputs
      4. 9.1.4  VCXO/Crystal Buffered Output
      5. 9.1.5  Frequency Holdover
      6. 9.1.6  PLL2 Integrated Loop Filter Poles
      7. 9.1.7  Internal VCOs
        1. 9.1.7.1 VCO1 Divider (LMK04821 only)
      8. 9.1.8  External VCO Mode
      9. 9.1.9  Clock Distribution
        1. 9.1.9.1 Device Clock Divider
        2. 9.1.9.2 SYSREF Clock Divider
        3. 9.1.9.3 Device Clock Delay
        4. 9.1.9.4 SYSREF Delay
        5. 9.1.9.5 Glitchless Half Step and Glitchless Analog Delay
        6. 9.1.9.6 Programmable Output Formats
        7. 9.1.9.7 Clock Output Synchronization
      10. 9.1.10 Zero-Delay
      11. 9.1.11 Status Pins
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 SYNC/SYSREF
      2. 9.3.2 JEDEC JESD204B
        1. 9.3.2.1 How To Enable SYSREF
          1. 9.3.2.1.1 Setup of SYSREF Example
          2. 9.3.2.1.2 SYSREF_CLR
        2. 9.3.2.2 SYSREF Modes
          1. 9.3.2.2.1 SYSREF Pulser
          2. 9.3.2.2.2 Continuous SYSREF
          3. 9.3.2.2.3 SYSREF Request
      3. 9.3.3 Digital Delay
        1. 9.3.3.1 Fixed Digital Delay
          1. 9.3.3.1.1 Fixed Digital Delay Example
        2. 9.3.3.2 Dynamic Digital Delay
        3. 9.3.3.3 Single and Multiple Dynamic Digital Delay Example
      4. 9.3.4 SYSREF to Device Clock Alignment
      5. 9.3.5 Input Clock Switching
        1. 9.3.5.1 Input Clock Switching - Manual Mode
        2. 9.3.5.2 Input Clock Switching - Pin Select Mode
        3. 9.3.5.3 Input Clock Switching - Automatic Mode
      6. 9.3.6 Digital Lock Detect
      7. 9.3.7 Holdover
        1. 9.3.7.1 Enable Holdover
          1. 9.3.7.1.1 Fixed (Manual) CPout1 Holdover Mode
          2. 9.3.7.1.2 Tracked CPout1 Holdover Mode
        2. 9.3.7.2 Entering Holdover
        3. 9.3.7.3 During Holdover
        4. 9.3.7.4 Exiting Holdover
        5. 9.3.7.5 Holdover Frequency Accuracy and DAC Performance
        6. 9.3.7.6 Holdover Mode - Automatic Exit of Holdover
    4. 9.4 Device Functional Modes
      1. 9.4.1 Dual PLL
      2. 9.4.2 Zero-Delay Dual PLL
      3. 9.4.3 Single-Loop Mode
      4. 9.4.4 Single-Loop Mode With External VCO
      5. 9.4.5 Distribution Mode
    5. 9.5 Programming
      1. 9.5.1 Recommended Programming Sequence
        1. 9.5.1.1 SPI LOCK
        2. 9.5.1.2 SYSREF_CLR
        3. 9.5.1.3 RESET Pin
    6. 9.6 Register Maps
      1. 9.6.1 Register Map for Device Programming
    7. 9.7 Device Register Descriptions
      1. 9.7.1 System Functions
        1. 9.7.1.1 RESET, SPI_3WIRE_DIS
        2. 9.7.1.2 POWERDOWN
        3. 9.7.1.3 ID_DEVICE_TYPE
        4. 9.7.1.4 ID_PROD[15:8], ID_PROD
        5. 9.7.1.5 ID_MASKREV
        6. 9.7.1.6 ID_VNDR[15:8], ID_VNDR
      2. 9.7.2 (0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
        1. 9.7.2.1 CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKoutX_DIV
        2. 9.7.2.2 DCLKoutX_DDLY_CNTH, DCLKoutX_DDLY_CNTL
        3. 9.7.2.3 DCLKoutX_ADLY, DCLKoutX_ADLY_MUX, DCLKout_MUX
        4. 9.7.2.4 DCLKoutX_HS, SDCLKoutY_MUX, SDCLKoutY_DDLY, SDCLKoutY_HS
        5. 9.7.2.5 SDCLKoutY_ADLY_EN, SDCLKoutY_ADLY
        6. 9.7.2.6 DCLKoutX_DDLY_PD, DCLKoutX_HSg_PD, DCLKout_ADLYg_PD, DCLKout_ADLY_PD, DCLKoutX_Y_PD, SDCLKoutY_DIS_MODE, SDCLKoutY_PD
        7. 9.7.2.7 SDCLKoutY_POL, SDCLKoutY_FMT, DCLKoutX_POL, DCLKoutX_FMT
      3. 9.7.3 SYSREF, SYNC, and Device Config
        1. 9.7.3.1  VCO_MUX, OSCout_MUX, OSCout_FMT
        2. 9.7.3.2  SYSREF_CLKin0_MUX, SYSREF_MUX
        3. 9.7.3.3  SYSREF_DIV[12:8], SYSREF_DIV[7:0]
        4. 9.7.3.4  SYSREF_DDLY[12:8], SYSREF_DDLY[7:0]
        5. 9.7.3.5  SYSREF_PULSE_CNT
        6. 9.7.3.6  PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
        7. 9.7.3.7  PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
        8. 9.7.3.8  DDLYdSYSREF_EN, DDLYdX_EN
        9. 9.7.3.9  DDLYd_STEP_CNT
        10. 9.7.3.10 SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
        11. 9.7.3.11 SYNC_DISSYSREF, SYNC_DISX
        12. 9.7.3.12 Fixed Registers (0x145, 0x171 - 0x172)
      4. 9.7.4 (0x146 - 0x149) CLKin Control
        1. 9.7.4.1 CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
        2. 9.7.4.2 CLKin_SEL_POL, CLKin_SEL_MODE, CLKin1_OUT_MUX, CLKin0_OUT_MUX
        3. 9.7.4.3 CLKin_SEL0_MUX, CLKin_SEL0_TYPE
        4. 9.7.4.4 SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
      5. 9.7.5 RESET_MUX, RESET_TYPE
      6. 9.7.6 (0x14B - 0x152) Holdover
        1. 9.7.6.1 LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
        2. 9.7.6.2 MAN_DAC[9:8], MAN_DAC[7:0]
        3. 9.7.6.3 DAC_TRIP_LOW
        4. 9.7.6.4 DAC_CLK_MULT, DAC_TRIP_HIGH
        5. 9.7.6.5 DAC_CLK_CNTR
        6. 9.7.6.6 CLKin_OVERRIDE, HOLDOVER_PLL1_DET, HOLDOVER_LOS_DET, HOLDOVER_VTUNE_DET, HOLDOVER_HITLESS_SWITCH, HOLDOVER_EN
        7. 9.7.6.7 HOLDOVER_DLD_CNT[13:8], HOLDOVER_DLD_CNT[7:0]
      7. 9.7.7 (0x153 - 0x15F) PLL1 Configuration
        1. 9.7.7.1 CLKin0_R[13:8], CLKin0_R[7:0]
        2. 9.7.7.2 CLKin1_R[13:8], CLKin1_R[7:0]
        3. 9.7.7.3 CLKin2_R[13:8], CLKin2_R[7:0]
        4. 9.7.7.4 PLL1_N
        5. 9.7.7.5 PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
        6. 9.7.7.6 PLL1_DLD_CNT[13:8], PLL1_DLD_CNT[7:0]
        7. 9.7.7.7 PLL1_R_DLY, PLL1_N_DLY
        8. 9.7.7.8 PLL1_LD_MUX, PLL1_LD_TYPE
      8. 9.7.8 (0x160 - 0x16E) PLL2 Configuration
        1. 9.7.8.1 PLL2_R[11:8], PLL2_R[7:0]
        2. 9.7.8.2 PLL2_P, OSCin_FREQ, PLL2_XTAL_EN, PLL2_REF_2X_EN
        3. 9.7.8.3 PLL2_N_CAL
        4. 9.7.8.4 PLL2_FCAL_DIS, PLL2_N
        5. 9.7.8.5 PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
        6. 9.7.8.6 SYSREF_REQ_EN, PLL2_DLD_CNT
        7. 9.7.8.7 PLL2_LF_R4, PLL2_LF_R3
        8. 9.7.8.8 PLL2_LF_C4, PLL2_LF_C3
        9. 9.7.8.9 PLL2_LD_MUX, PLL2_LD_TYPE
      9. 9.7.9 (0x16F - 0x1FFF) Misc Registers
        1. 9.7.9.1  PLL2_PRE_PD, PLL2_PD
        2. 9.7.9.2  VCO1_DIV
        3. 9.7.9.3  OPT_REG_1
        4. 9.7.9.4  OPT_REG_2
        5. 9.7.9.5  RB_PLL1_LD_LOST, RB_PLL1_LD, CLR_PLL1_LD_LOST
        6. 9.7.9.6  RB_PLL2_LD_LOST, RB_PLL2_LD, CLR_PLL2_LD_LOST
        7. 9.7.9.7  RB_DAC_VALUE(MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
        8. 9.7.9.8  RB_DAC_VALUE
        9. 9.7.9.9  RB_HOLDOVER
        10. 9.7.9.10 SPI_LOCK
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Digital Lock Detect Frequency Accuracy
      1. 10.2.1 Minimum Lock Time Calculation Example
    3. 10.3 Driving CLKin and OSCin Inputs
      1. 10.3.1 Driving CLKin and OSCin Pins With a Differential Source
      2. 10.3.2 Driving CLKin and OSCin Pins With a Single-Ended Source
    4. 10.4 Output Termination and Biasing
      1. 10.4.1 LVPECL
      2. 10.4.2 LVDS/HSDS
    5. 10.5 Typical Applications
      1. 10.5.1 Design Example
        1. 10.5.1.1 Design Requirements
        2. 10.5.1.2 Detailed Design Procedure
          1. 10.5.1.2.1 Device Configuration and Simulation - PLLatinum Sim
          2. 10.5.1.2.2 Device Programming
        3. 10.5.1.3 Application Curves
    6. 10.6 System Examples
      1. 10.6.1 System Level Diagram
    7. 10.7 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Pin Connection Recommendations
      1. 11.1.1 VCC Pins and Decoupling
        1. 11.1.1.1 Clock Output Supplies
        2. 11.1.1.2 Low-Crosstalk Supplies
        3. 11.1.1.3 PLL2 Supplies
        4. 11.1.1.4 Clock Input Supplies
        5. 11.1.1.5 Unused Clock Inputs/Outputs
    2. 11.2 Current Consumption / Power Dissipation Calculations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Thermal Management
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 PLLatinum Sim
        2. 13.1.1.2 TICS Pro
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1.1.2 Low-Crosstalk Supplies

These supplies include Vcc1_VCO, Vcc5_DIG, and Vcc6_PLL1.

Each of these pins has internal bypass capacitance. Ferrite beads should not be needed between these pins and the power supply. A ferrite bead can optionally before the common point connecting these supplies, in which case a large decoupling capacitance (1 µF or more) should be used for voltage stability after the ferrite bead. The typical application diagram in Figure 41 shows all these supply pins connected together to the power supply with an optional ferrite bead and decoupling capacitance.

These supplies are considered low-crosstalk supplies because they do not generate much noise. Vcc1_VCO noise is effectively captured by the on-chip bypass capacitance, since noise from this pin is typically very high frequency. This pin also uses a high-quality integrated LDO to minimize noise below 30 MHz. Vcc5_DIG is only active at startup and during GPIO events, so after startup there is no continuous noise contribution from this pin. Vcc6_PLL1 is usually low-noise as well, due to the low frequency of the PLL1 phase detector. An on-chip LDO regulates this supply and prevents most PLL1 charge pump noise from escaping. If the PLL1 phase detector is set to a high frequency, a ferrite bead may optionally be used on this supply. If a ferrite bead is used with this supply, the DC resistance of this ferrite bead should be minimized to avoid voltage fluctuation at the PLL1 supply/PLL1 charge pump, and a 0.1-µF decoupling capacitor should be placed after the ferrite bead close to the supply pin.