SNAS888A September 2024 – November 2024 LMK1D2102L
PRODUCTION DATA
For reliability and performance reasons, the die temperature must be limited to a maximum of 135°C.
The device package has an exposed pad that provides the primary heat removal path to the printed circuit board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The thermal pad must be soldered down to provide adequate heat conduction to of the package. Section 9.4.2 show the recommended top layer and via patterns for the different packages.