SNAS750B November   2020  – March 2021 LMK5C33216

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Diagrams
  8. 8 Parameter Measurement Information
    1. 8.1 Differential Voltage Measurement Terminology
    2. 8.2 Output Clock Test Configurations
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
      1. 9.2.1 PLL Architecture Overview
      2. 9.2.2 DPLL
        1. 9.2.2.1 Independent DPLL Operation
        2. 9.2.2.2 Cascaded DPLL Operation
        3. 9.2.2.3 APLL Cascaded with DPLL
      3. 9.2.3 APLL-Only Mode
    3. 9.3 Feature Description
      1. 9.3.1  Oscillator Input (XO)
      2. 9.3.2  Reference Inputs
      3. 9.3.3  Clock Input Interfacing and Termination
      4. 9.3.4  Reference Input Mux Selection
        1. 9.3.4.1 Automatic Input Selection
        2. 9.3.4.2 Manual Input Selection
      5. 9.3.5  Hitless Switching
        1. 9.3.5.1 Hitless Switching with Phase Cancellation
        2. 9.3.5.2 Hitless Switching With Phase Slew Control
        3. 9.3.5.3 Hitless Switching With 1-PPS Inputs
      6. 9.3.6  Gapped Clock Support on Reference Inputs
      7. 9.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 9.3.7.1 XO Input Monitoring
        2. 9.3.7.2 Reference Input Monitoring
          1. 9.3.7.2.1 Reference Validation Timer
          2. 9.3.7.2.2 Frequency Monitoring
          3. 9.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 9.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 9.3.7.2.5 Phase Valid Monitor for 1-PPS Inputs
        3. 9.3.7.3 PLL Lock Detectors
        4. 9.3.7.4 Tuning Word History
        5. 9.3.7.5 Status Outputs
        6. 9.3.7.6 Interrupt
      8. 9.3.8  PLL Relationships
        1. 9.3.8.1  PLL Frequency Relationships
          1. 9.3.8.1.1 APLL Phase Detector Frequency
          2. 9.3.8.1.2 APLL VCO Frequency
          3. 9.3.8.1.3 DPLL TDC Frequency
          4. 9.3.8.1.4 DPLL VCO Frequency
          5. 9.3.8.1.5 Clock Output Frequency
        2. 9.3.8.2  Analog PLLs (APLL1, APLL2, APLL3)
        3. 9.3.8.3  APLL Reference Paths
          1. 9.3.8.3.1 APLL XO Doubler
          2. 9.3.8.3.2 APLL XO Reference (R) Divider
        4. 9.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 9.3.8.5  APLL Feedback Divider Paths
          1. 9.3.8.5.1 APLL N Divider with SDM
        6. 9.3.8.6  APLL Loop Filters (LF1, LF2, LF3)
        7. 9.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2, VCO3)
          1. 9.3.8.7.1 VCO Calibration
        8. 9.3.8.8  APLL VCO Clock Distribution Paths
        9. 9.3.8.9  DPLL Reference (R) Divider Paths
        10. 9.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 9.3.8.11 DPLL Loop Filter (DLF)
        12. 9.3.8.12 DPLL Feedback (FB) Divider Path
      9. 9.3.9  Output Clock Distribution
      10. 9.3.10 Output Channel Muxes
      11. 9.3.11 Output Dividers (OD)
      12. 9.3.12 SYSREF
      13. 9.3.13 Output Delay
      14. 9.3.14 Clock Outputs (OUTx_P/N)
        1. 9.3.14.1 Differential Output
        2. 9.3.14.2 LVCMOS Output
        3. 9.3.14.3 Output Auto-Mute During LOL
      15. 9.3.15 Glitchless Output Clock Start-Up
      16. 9.3.16 Clock Output Interfacing and Termination
      17. 9.3.17 Output Synchronization (SYNC)
      18. 9.3.18 Zero-Delay Mode (ZDM) Synchronization
      19. 9.3.19 Time of Day (ToD) Counter
        1. 9.3.19.1 Configuring ToD Functionality
        2. 9.3.19.2 SPI as a Trigger Source
        3. 9.3.19.3 GPIO Pin as a ToD Trigger Source
          1. 9.3.19.3.1 An Example: Making a time measurement using ToD and GPIO1 as trigger
        4. 9.3.19.4 ToD Timing
        5. 9.3.19.5 Other ToD Behavior
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Start-Up
        1. 9.4.1.1 ROM Selection
        2. 9.4.1.2 EEPROM Overlay
      2. 9.4.2 DPLL Operating States
        1. 9.4.2.1 Free-Run
        2. 9.4.2.2 Lock Acquisition
        3. 9.4.2.3 DPLL Locked
        4. 9.4.2.4 Holdover
      3. 9.4.3 PLL Start-Up Sequence
      4. 9.4.4 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 9.4.4.1 DPLL DCO Control
          1. 9.4.4.1.1 DPLL DCO Relative Adjustment Frequency Step Size
          2. 9.4.4.1.2 APLL DCO Frequency Step Size
      5. 9.4.5 APLL Frequency Control
      6. 9.4.6 Zero-Delay Mode Synchronization
    5. 9.5 Programming
      1. 9.5.1 Interface and Control
      2. 9.5.2 I2C Serial Interface
        1. 9.5.2.1 I2C Block Register Transfers
      3. 9.5.3 SPI Serial Interface
        1. 9.5.3.1 SPI Block Register Transfer
      4. 9.5.4 Register Map Generation
      5. 9.5.5 General Register Programming Sequence
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Device Start-Up Sequence
      2. 10.1.2 Power Down (PD#) Pin
      3. 10.1.3 Strap Pins for Start-Up
      4. 10.1.4 ROM and EEPROM
      5. 10.1.5 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 10.1.5.1 Power-On Reset (POR) Circuit
        2. 10.1.5.2 Powering Up From a Single-Supply Rail
        3. 10.1.5.3 Power Up From Split-Supply Rails
        4. 10.1.5.4 Non-Monotonic or Slow Power-Up Supply Ramp
      6. 10.1.6 Slow or Delayed XO Start-Up
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Bypassing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Reliability
      1. 12.3.1 Support for PCB Temperature up to 105°C
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Glossary
    6. 13.6 Electrostatic Discharge Caution
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-20201023-CA0I-KJG6-WL3X-SM51ZZV217CX-low.svg Figure 6-1 LMK5C33216 RGC Package 64-Pin VQFN Top View
Table 6-1 LMK5C33216 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
POWER
VDDO_0_1 1 P Power supply for OUT0 and OUT1
VDD_APLL1_XO 8 P Power supply for XO and APLL1
VDDO_2_3 11 P Power supply for OUT2 and OUT3
VDD_APLL2 23 P Power supply for APLL2
VDDO_4_TO_7 28 P Power supply for OUT4 to OUT7
VDD_IN0 33 P Power supply for IN0 DPLL reference
VDD_IN1 37 P Power supply for IN1 input port
VDD_DIG 41 P Power supply for digital
VDDO_14_15 44 P Power supply for OUT14 and OUT15
VDD_APLL3 47 P Power supply for APLL3
VDDO_8_TO_13 55 P Power supply for OUT8 to OUT13
DAP N/A G Ground
CORE BLOCKS(2)
LF1 6 A External loop filter cap for APLL1 (100 nF)
CAP_APLL1 7 A LDO bypass capacitor for APLL1 VCO (10 µF)
LF2 19 A External loop filter cap for APLL2 (100 nF)
CAP3_APLL2 20 A Internal bias bypass capacitor for APLL2 VCO (10 µF)
CAP2_APLL2 21 A Internal bias bypass capacitor for APLL2 VCO (10 µF)
CAP1_APLL2 22 A LDO bypass capacitor for APLL2 VCO (10 µF)
CAP_DIG 40 A LDO bypass capacitor for Digital Core Logic (100 nF)
CAP_APLL3 48 A Internal bias bypass capacitor for APLL3 (10 µF)
LF3 49 A External loop filter cap for APLL3 (470 nF)
INPUT BLOCKS
XO 9 I XO/TCXO/OCXO input pin
IN0_P 34 I Reference to DPLLx or buffered to OUT0 or OUT1
IN0_N 35 I
IN1_N 38 I Reference to DPLLx or buffered to OUT0 or OUT1
IN1_P 39 I
OUTPUT BLOCKS
OUT0_P 2 O Clock Output 0. Sources from all DPLL references, XO, all VCO post-dividers. Support SYSREF output. Programmable formats: LVPECL, LVDS, HSDS, 1.8-V LVCMOS, or 2.65-V LVCMOS.
OUT0_N 3 O
OUT1_N 4 O Clock Output 1. Sources from all DPLL references, XO, all VCO post-dividers. Support SYSREF output. Programmable formats: LVPECL, LVDS, HSDS, 1.8-V LVCMOS, or 2.65-V LVCMOS.
OUT1_P 5 O
OUT2_P 12 O Clock Output 2. Sources from VCO1 and VCO2. No SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT2_N 13 O
OUT3_N 14 O Clock Output 3. Sources from VCO1 and VCO2. No SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT3_P 15 O
OUT5_P 24 O Clock Output 5. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT5_N 25 O
OUT4_N 26 O Clock Output 4. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, HSDS, or CML. High-frequency output with channel divider bypass in open-collector CML format.
OUT4_P 27 O
OUT6_P 29 O Clock Output 6. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, HSDS, or CML. High-frequency output with channel divider bypass in open-collector CML format.
OUT6_N 30 O
OUT7_N 31 O Clock Output 7. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT7_P 32 O
OUT14_P 42 O Clock Output 14. Sources from VCO1, VCO2, and VCO3. No SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT14_N 43 O
OUT15_N 45 O Clock Output 15. Sources from VCO1, VCO2, and VCO3. No SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT15_P 46 O
OUT8_P 51 O Clock Output 8. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT8_N 52 O
OUT9_N 53 O Clock Output 9. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT9_P 54 O
OUT10_P 56 O Clock Output 10. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT10_N 57 O
OUT11_N 58 O Clock Output 11. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT11_P 59 O
OUT12_P 60 O Clock Output 12. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT12_N 61 O
OUT13_N 62 O Clock Output 13. Sources from VCO2 and VCO3. Support SYSREF output. Programmable formats: LVPECL, LVDS, or HSDS.
OUT13_P 63 O
LOGIC CONTROL/STATUS
GPIO2(3) 10 I/O, S POR: ROM page select
Normal Operation: GPIO input or output (see description)
SDIO(4) 16 I/O SPI or I2C Data (SDA)
SCK(4) 17 I SPI or I2C Clock (SCL)
SCS_ADD(3) 18 I, S SPI Chip Select (2-state) or POR: I2C address select, LSB (3-state)
PD# 36 I Device power down (Active low), internal 200-kΩ pullup to VCC
GPIO0(3) 50 I/O, S POR: ROM page select
Normal Operation: GPIO input or output (see description)
GPIO1(3) 64 I/O, S POR: I2C or SPI select
Normal Operation: GPIO input or output (see description)
(1) P = Power, G = Ground, I = Input, O = Output, I/O = Input or Output, A = Analog, S = Configuration.
(2) Do not apply external stimulus to core pins. These performance critical pins are not designed to meet normal latch up testing compliance levels. For best filtering performance, capacitors should be placed close to the IC.
(3) When 3 level mode is enabled during power supply ramp or when PD# is LOW: internal voltage divider of 555 kΩ to VCC and 201 kΩ to GND. When 2 level input mode is enabled: internal 408-kΩ pulldown to GND.
(4) 670-kΩ pullup to internal 2.6-V LDO.