SNAS634B March   2014  – January 2016 LMP92066

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Output Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Features Description
      1. 8.3.1 Temperature Sensor
      2. 8.3.2 Look-Up-Table (LUT) and Arithmetic-Logic Unit (ALU)
        1. 8.3.2.1 LUT and ALU Organization
        2. 8.3.2.2 LUT Coefficient to Register Mapping
        3. 8.3.2.3 The LUT Input and Output Ranges
      3. 8.3.3 Analog Signal Path
        1. 8.3.3.1 DAC
        2. 8.3.3.2 Buffer Amplifier
        3. 8.3.3.3 Output On and Off Control
      4. 8.3.4 Memory
        1. 8.3.4.1 READ and WRITE Access
        2. 8.3.4.2 Access Control
        3. 8.3.4.3 LUT, NOTEPAD Storage, and EEPROM
      5. 8.3.5 I2C Interface
        1. 8.3.5.1 Supported Data Transfer Formats
        2. 8.3.5.2 Slave Address Selection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Default Operating Mode
      2. 8.4.2 Temperature Sensor Override
      3. 8.4.3 ALU Bypass
      4. 8.4.4 DAC Input Override
      5. 8.4.5 LDMOS and GaN Drives
    5. 8.5 Programming
      1. 8.5.1  Temperature Sensor Output Data Access Registers
      2. 8.5.2  DAC Input Data Registers
      3. 8.5.3  Temperature Sensor Status Register
      4. 8.5.4  Override Control Register
      5. 8.5.5  Override Data Registers
      6. 8.5.6  EEPROM Control Register
      7. 8.5.7  Software RESET Register
      8. 8.5.8  Access Control Register
      9. 8.5.9  Block I2C Access Control Register
      10. 8.5.10 I2C Address LOCK Register
      11. 8.5.11 Output Drive Supply Status Register
      12. 8.5.12 Device Version Register
      13. 8.5.13 EEPROM Burn Counter
      14. 8.5.14 LUT Coefficient Registers
      15. 8.5.15 LUT Control Registers
      16. 8.5.16 Notepad Registers
    6. 8.6 Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Temperature Compensated Bias Generator for LDMOS Power Amplifer (PA)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Requirements
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Temperature Compensated Bias Generator for GaN Power Amplifer (PA)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Output Drive Switching
    4. 9.4 Initialization Setup
      1. 9.4.1 Factory Default
      2. 9.4.2 At Power Up
  10. 10Power Supply Recommendations
    1. 10.1 VDD Supply Sourcing
    2. 10.2 IVDD During EEPROM BURN
    3. 10.3 IVDD During EEPROM TRANSFER
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VDD Supply voltage with respect to GNDA –0.3 5.5 V
VDDB –0.3 5.5
VIO –0.3 5.5
VSSB –5.5 0.3
GNDD –0.3 0.3
VDDB to VSSB –0.3 5.5 V
Any other pins to GNDA –0.3 5.5
DAC output current 10 mA
Current at all other pins 5
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operational temperature –40 125 °C
Specification temperature –25 120
DAC output load capacitance 8 12 µF
VDD Supply voltage range (VDD) 4.75 5.25 V
VIO Digital I/O supply voltage 1.65 3.3
VDDB–VSSB LDMOS mode VSSB = GNDA 5
GaN mode VSSB = –5 V 5

7.4 Thermal Information

THERMAL METRIC(1) PWP (HTSSOP)
16 PINS		 UNIT
RθJA Junction-to-ambient thermal resistance 38.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.3
RθJB Junction-to-board thermal resistance 15.1
ψJT Junction-to-top characterization parameter 0.5
ψJB Junction-to-board characterization parameter 14.9
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

Unless otherwise noted: VDD = 5 V ±5%, VIO = 1.8 V to 3.3 V, TA = 25°C. VDDB = 5 V ±5%, VSSB = GNDA, VDACx output range 0 V to 5 V; or VDDB = GNDA, VSSB = –5 V ±5%, VDACx output range 0 V to –5V. DAC input code range 48 to 4047. VDACX load CL = 10 µF.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG SIGNAL PATH CHARACTERISTICS (DAC, Buffer Amplifier, Internal Reference)
Resolution –25°C < TA < 120°C 12 12 Bits
Monotonic 12
DNL Differential non-linearity RL = 100 kΩ, –25°C < TA < 120°C –0.99 1 LSB
INL Integral non-linearity RL = 100 kΩ, –25°C < TA < 120°C −1.93 2.78
OE Offset error(1) LDMOS mode, RL = 100 kΩ,
–25°C < TA < 120°C		 –14 14 mV
LDMOS mode, RL = 100 kΩ ±1
GaN mode, RL = 100 kΩ, –25°C < TA < 120°C –16.5 16.5
OETC Offset error temperature coefficient(1)(2) RL = 100 kΩ, –25°C < TA < 120°C 43 μV/°C
GE Gain error(1) RL = 100 kΩ, –25°C < TA < 120°C –0.72 0.74 %FS
GETC Gain error temperature coefficient(1)(2) RL = 100 kΩ, –25°C < TA < 120°C 20 ppm/°C
REAOPC Residual error after one point calibration(1)(2)(3)(4) BASEx = 1638 (VDACX = 2 V at 24°C)
–25°C < TA < 120°C		 –13.3 13.3 mV
BASEx = 1638 (VDACX = 2 V at 24°C) ±2.4
BASEx = 819 (VDACX = 1 V at 24°C)
–25°C < TA < 120°C		 –11.3 11.3
BASEx = 819 (VDACX = 1 V at 24°C) ±2.1
ZCO Zero code output (VDACx – VSSB) LDMOS mode, RL = 100 kΩ 0 mV
LDMOS mode, IOUT = 10 mA 200
FSO Full-scale output at code 4095 (VDDB – VDACx) LDMOS mode, RL = 100 kΩ 10 mV
LDMOS mode, IOUT = –10 mA 150
IO Continuous output current per channel allowed(5) TA = 125°C 10 mA
CL Load capacitance(5) RL = 2 kΩ or ∞, –25°C < TA < 120°C 12 µF
RL = 2 kΩ or ∞ 10
DAC output resistance DACCODEx = 2048 3 Ω
DAC settling time CL = 10 µF 250 µs
OUTPUT SWITCH DC CHARACTERISTICS
RDRV On Resistance of the switch between DACx and FETDRVx –25°C < TA < 120°C 6 Ω
RG On Resistance of the switch between FETDRVx and VSSB 11
TEMPERATURE SENSOR CHARACTERISTICS
Resolution 0.0625 °C/lsb
TE Temperature sensor error(2) TA = –40°C to 120°C –3.2 3.2 °C
Conversion time 25 ms
EEPROM
Maximum EEPROM write cycles 100
DIGITAL INPUT CHARACTERISTICS (DRVEN0, DRVEN1, SDA, and SCL)
VIH Input high voltage –25°C < TA < 120°C 0.7 × VIO V
VIL Input low voltage –25°C < TA < 120°C 0.3 × VIO
Hysteresis 0.2 × VIO
CiND Input capacitance 5 pF
DIGITAL INPUT CHARACTERISTICS (A0, A1)
VIH Input high voltage –25°C < TA < 120°C 0.7 × VIO V
VIL Input low voltage –25°C < TA < 120°C 0.3 × VIO
RUP Internal pullup resistance 17 kΩ
RDN Internal pulldown resistance 17
Max external capacitance(5) 30 pF
DIGITAL OUTPUT CHARACTERISTICS (SDA)
VOL Output low voltage IOUT = 4 mA, –25°C < TA < 120°C 0.4 V
IOUT = 4 mA 0.16
ILEAK Open-drain output leakage current with output high(5) Current from the supply rail through the pullup resistor into the drain of the open-drain output device, –25°C < TA < 120°C ±1 μA
COUT Output capacitance 4 pF
SUPPLY CURRENT SPECIFICATIONS
IDD Normal operation(6),(7) –25°C < TA < 120°C 2.6 mA
While executing EEPROM BURN(8) 4
While transferring EEPROM content to operating memory(9) 9
IVIO I2C inactive, –25°C < TA < 120°C 3 µA
I2C in fast mode, –25°C < TA < 120°C 3.1
IVDDB LDMOS mode, RL = ∞, –25°C < TA < 120°C 1.5 mA
IVSSB GaN mode, RL = ∞, –25°C < TA < 120°C –1.4
PWR (Conv) Power consumption, conversion mode All output pins RL = ∞ 20 mW
(1) The package mechanical stress-induced parameter shift may cause the parts to manifest behavior beyond the specified limits. Mechanical stresses may also arise as a result of the PCB manufacturing process.
(2) Device specification is verified by characterization and is not tested in production.
(3) The specification is a calculated worst-case value based on the OE, OETC, GE, and GETC limits.
(4) The outcome of the REAOPC characterization of the PCB mounted devices is shown in Figure 4, Figure 5, and Figure 6 of the Typical Characteristics. The 97, randomly selected, devices from 3 diffusion lots were installed on the 4-layer RO4003 Laminate using Convection Reflow. The Look-Up-Table was set for maximum gain; for example, all DELx = 0xFF. While powered up, the devices were subjected to 3 thermal cycles, from –40°C to 125°C, during which their REAOPC was recorded.
(5) Parameter based on the process data and circuit simulation.
(6) The normal operation current through the VDD excludes the current supplied to the external load, and excludes the current required by the EPPROM BURNS and TRANSFERS.
(7) The power supply must be capable of sourcing a minimum of 50mA in order to avoid the continuous activation of the LMP92066’s power-on-reset (POR) circuit.
(8) During the EEPROM BURN command execution the device activates internal systems that are not active during the Normal operation. This causes a momentary increase in supply current through the VDD pin. The duration of this temporary surge in supply current is typically 125 ms.
(9) During the data transfer from the EEPROM to the Operating memory there will be a momentary surge in supply current through the VDD pin. The duration of this surge is typically 200 µs.

7.6 Timing Requirements

Unless otherwise noted: VDD = 5 V ±5%, VIO = 1.8 V to 3.3 V. VDDB = 5 V ±5%, VSSB = GNDA; or VDDB = GNDA, VSSB = –5V ±5%.
PARAMETER TEST CONDITIONS MIN MAX UNIT
I2C clock frequency 10 400 kHz
tLOW Clock low time 1.3 µs
tHIGH Clock high time 0.6
tHD-STA Hold time repeated START condition After this period, the first clock pulse is generated 0.6
tSU;STA Setup time for a repeated START condition 0.6
tHD;DAT Data hold time (Note x and y) 0 900 ns
tSU;DAT Data setup time 100
tf SDA fall time IL ≤ 3 mA and CL ≤ 400 pF 250
tSU;STO Setup time for STOP condition 0.6 µs
tBUF Bus free time between a STOP and START condition 1.3
Cb SDA capacitive load 400 pF
tSP Pulse width of spikes that must be suppressed by the input filter 50 ns
SCL and SDA timeout 25 35 ms

7.7 Output Switching Characteristics

Unless otherwise noted: VDD = 5 V ±5%, VIO = 1.8 V to 3.3 V. VDDB = 5 V ±5%, VSSB = GNDA; or VDDB = GNDA, VSSB = –5V ±5%.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON On time DACCODEx = 4095, RL = 100 kΩ 50 ns
tOFF Off time 50
tBBM Break-before-make time 15
CFETDRV FETDRV output capacitance 10 pF
LMP92066 timing_diag.gif Figure 1. I2C Timing
LMP92066 td_change_over_snas634.gif Figure 2. Switching

7.8 Typical Characteristics

Unless otherwise stated the plot data was collected under these conditions: VDD = 5 V, VDDB = 5 V, VSSB = GNDA, VIO = 3.3 V, Temperature = 24°C, RL = 100 kΩ.
LMP92066 C001_snas634.png
Figure 3. Temperature Sensor Error
LMP92066 C009_snas634.png
BASE = 1638 PCB Mounted
97 devices 3 Cycles: –40°C to 125°C
Figure 5. REAOPC
LMP92066 C002_snas634.png
Figure 7. DAC DNL
LMP92066 C004_snas634.png
Figure 9. DAC MIN/MAX DNL vs Temperature
LMP92066 C006_snas634.png
TEMP = –40°C to 120°C
Figure 11. DAC Offset Error
LMP92066 C011_snas634.gif
DAC OVERRIDE MODE I2C command triggers DAC step
CL = 10 µF Step size: 1/4 to 3/4 FS
Figure 13. DAC Step Response
LMP92066 C013_snas634.gif
DAC OVERRIDE MODE I2C command triggers DAC step
CL = 10 µF Step size: 3/4 to 1/4 FS
Figure 15. DAC Step Response
LMP92066 C015_snas634.png
Figure 17. RDRV Resistance vs DAC Output Level
LMP92066 C017_snas634.png
Figure 19. Output Switch ON Time vs Temperature
LMP92066 C019_snas634.png
Figure 21. Ground Switch Resistance When Closed
LMP92066 C008_snas634.png
BASE = 819 PCB Mounted
97 devices 3 Cycles: –40°C to 125°C
Figure 4. REAOPC
LMP92066 C010_snas634.png
BASE = 3277 PCB Mounted
97 devices 3 Cycles: –40°C to 125°C
Figure 6. REAOPC
LMP92066 C003_snas634.png
Figure 8. DAC INL
LMP92066 C005_snas634.png
Figure 10. DAC MIN/MAX INL vs Temperature
LMP92066 C007_snas634.png
TEMP = –40°C to 120°C
Figure 12. DAC Gain Error
LMP92066 C012_snas634.gif
DAC OVERRIDE MODE I2C command triggers DAC step
CL = 10 pF Step size: 1/4 to 3/4 FS
Figure 14. DAC Step Response
LMP92066 C014_snas634.gif
DAC OVERRIDE MODE I2C command triggers DAC step
CL = 10 pF Step size: 3/4 to 1/4 FS
Figure 16. DAC Step Response
LMP92066 C016_snas634.png
Figure 18. RDRV vs Temperature
LMP92066 C018_snas634.png
Figure 20. Output Switch ON Time