SNAS877 December   2024 LMR60440

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Undervoltage Lockout (UVLO)
      2. 7.3.2 Soft Start and Recovery from Dropout
      3. 7.3.3 Frequency Selection With RT
      4. 7.3.4 MODE/SYNC Pin Control
      5. 7.3.5 Output Voltage Selection
      6. 7.3.6 Current Limit
      7. 7.3.7 Hiccup Mode
      8. 7.3.8 Power-Good Function
      9. 7.3.9 Spread Spectrum
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Continuous Conduction Mode (CCM)
        2. 7.4.2.2 Auto Mode - Light Load Operation
        3. 7.4.2.3 FPWM Operation - Light Load Operation
        4. 7.4.2.4 Minimum On-Time
        5. 7.4.2.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency Selection
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bootstrap Capacitor (CBOOT) Selection
        6. 8.2.2.6 FB Voltage Divider for Adjustable Output Voltages
          1. 8.2.2.6.1 Feedforward Capacitor (CFF) Selection
        7. 8.2.2.7 RPG - PG Pullup Resistor
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Ground and Thermal Plane Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.