SNIS169F March   2013  – May 2024 LMT86

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Accuracy Characteristics
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LMT86 Transfer Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mounting and Thermal Conductivity
      2. 7.4.2 Output Noise Considerations
      3. 7.4.3 Capacitive Loads
      4. 7.4.4 Output Voltage Shift
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Connection to an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Conserving Power Dissipation With Shutdown
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision E (October 2017) to Revision F (May 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision D (June 2017) to Revision E (October 2017)

  • Moved the automotive device to a standalone data sheet (SNIS201) Go
  • Changed TO-92 GND pin number from: 1 to: 3 Go
  • Changed TO-92 VDD pin number from: 3 to: 1 Go

Changes from Revision C (October 2015) to Revision D (June 2017)

  • Updated data sheet text to the latest documentation and translations standardsGo
  • Added AEC-Q100 automotive qualification bullets to Features Go
  • Added Time Constant graphGo
  • Removed disk drivers, games, wireless transceivers, and cell phones from Applications Go
  • Added LPG (TO-92S) packageGo
  • Added Figure 6-10 to Typical Characteristics Go

Changes from Revision B (May 2014) to Revision C (October 2015)

  • Deleted all mentions of TO-126 packageGo
  • Added TO-92 LPM pin configuration graphicGo
  • Changed Handling Ratings to ESD Ratings and moved Storage Temperature to Absolute Maximum Ratings tableGo
  • Changed KV to V Go
  • Added layout recommendation for TO-92 LP and LPM packagesGo

Changes from Revision A (June 2013) to Revision B (May 2014)

  • Changed data sheet flow and layout to conform with new TI standards. Added the following sections: Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, Mechanical, Packaging, and Orderable Information Go
  • Added TO92 and TO126 package information.Go
  • Changed from 450°C/W to 275 °C/W. New specification is derived using TI ' s latest methodology. Go
  • Changed Temperature Accuracy VDD condition from 2.4V to 2.2V for range of 40°C to 150°C. Go
  • Deleted Note: The input current is leakage only and is highest at high temperature. It is typically only 0.001 µA. The 1 µA limit is solely based on a testing limitation and does not reflect the actual performance of the part.Go