SNVS723H October   2011  – October 2023 LMZ10500

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Start-up Behavior and Soft Start
      3. 7.3.3 Output Short Circuit Protection
      4. 7.3.4 Thermal Overload Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Circuit Operation
      2. 7.4.2 Input Undervoltage Detection
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 EN Pin Operation
      5. 7.4.5 Internal Synchronous Rectification
      6. 7.4.6 High Duty Cycle Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
          1. 8.2.2.2.1 RT and RB Selection for Fixed VOUT
          2. 8.2.2.2.2 Output Voltage Accuracy Optimization
        3. 8.2.2.3 Dynamic Output Voltage Scaling
        4. 8.2.2.4 Integrated Inductor
        5. 8.2.2.5 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 VOUT = 1.2 V
        2. 8.2.3.2 VOUT = 1.8 V
        3. 8.2.3.3 VOUT = 2.5 V
        4. 8.2.3.4 VOUT = 3.3 V
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Voltage Range
      2. 8.3.2 Current Capability
      3. 8.3.3 Input Connection
        1. 8.3.3.1 Voltage Drops
        2. 8.3.3.2 Stability
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Package Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (July 2018) to Revision H (October 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated trademark informationGo

Changes from Revision F (February 2015) to Revision G (July 2018)

  • editorial rebranding for SEOGo
  • Added links for Webench Go
  • Move storage temperature spec to Abs Max table Go
  • Changed "Handling" to "ESD" Ratings Go
  • Added Section 9.1 Go
  • Changed SIL package drawing to SIL0008G Go

Changes from Revision E (September 2014) to Revision F (February 2015)

Changes from Revision D (January 2014) to Revision E (September 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go