SNVSAO4D December   2017  – August 2020 LMZM33602

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics (VIN = 5 V)
    8. 6.8 Typical Characteristics (VIN = 12 V)
    9. 6.9 Typical Characteristics (VIN = 24 V)
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Feedforward Capacitor, CFF
      3. 7.3.3  Voltage Dropout
      4. 7.3.4  Switching Frequency (RT)
      5. 7.3.5  Synchronization (SYNC)
      6. 7.3.6  Input Capacitors
      7. 7.3.7  Output Capacitors
      8. 7.3.8  Output On/Off Enable (EN)
      9. 7.3.9  Programmable Undervoltage Lockout (UVLO)
      10. 7.3.10 Power Good (PGOOD)
      11. 7.3.11 Overcurrent Protection (OCP)
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Feedforward Capacitor (CFF)
        4. 8.2.2.4 Setting the Switching Frequency
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitor Selection
        7. 8.2.2.7 Application Curves
  9. 9Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN –0.3 42 V
EN/SYNC –5.5 VIN + 0.3 V
PGOOD –0.3 15 V
FB, RT –0.3 4.5 V
Output voltage SW –1 VIN + 0.3 V
SW (< 10-ns transients) –5 42 V
VOUT –0.3 VIN V
Sink current PGOOD 3 mA
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20 to 2000 Hz 20 G
Operating IC junction temperature, TJ (2) –40 125 °C
Operating ambient temperature, TA (2) –40 105 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.