4 Revision History
Changes from E Revision (December 2014) to F Revision
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Deleted "Assured" Go
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Changed "Output Pulldown Crowbar" to "Automatic Output Discharge" Go
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Changed "internal crowbar" to "automatic output discharge"Go
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Added word "input" after "battery" in Features and DescriptionGo
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Changed pin names for IN and OUT to match TI nomenclature; fix typosGo
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Changed max junc. temp from 125°C to 150°C Go
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Changed wording of footnote 12 Go
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Added second bullet for "LP2953 versions only" Go
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Added Automatic Output Dischange subsection Go
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Deleted sentence "To achieve the smallest form factor, the TO-92 package is selected."Go
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Changed "With an efficiency of 83.3% and a 250-mA maximum load, the internal power dissipation is 250 mW, which corresponds to a 19.2°C junction temperature rise for the SOIC package." to "With a VIN – VOUT differential of 1 V and a maximum load current of 250 mA the internal junction temperature (TJ) of the SOIC package will rise 19.2° above the ambient temperature."Go
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Deleted "Thermal Resistance for Various Copper Heatsinking Patterns" tableGo
Changes from D Revision (September 2013) to E Revision
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Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated Thermal Information values; deleted obsolete LP2953AM references Go
Changes from C Revision (March 2005) to D Revision
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Changed layout of National Data Sheet to TI formatGo