SNVS001F april   2000  – july 2023 LP2980-ADJ

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Current Limit
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Output Pulldown
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Feedback Resistors
      2. 8.1.2 Recommended Capacitor Types
        1. 8.1.2.1 Recommended Capacitors for the New Chip
        2. 8.1.2.2 Recommended Capacitors for the Legacy Chip
      3. 8.1.3 Input and Output Capacitor Requirements
      4. 8.1.4 Feed-Forward Capacitor (CFF)
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Estimating Junction Temperature
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting VOUT For the LP2980-ADJ LDO
        2. 8.2.2.2 ON/OFF Input Operation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision E (April 2013) to Revision F (July 2023)

  • Added ESD Ratings table, Overview section, Feature Description section, Device Functional Modes section, Application and Implementation section, Typical Application section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added new chip (M3 suffix) information to documentGo
  • Changed document title, Features, Applications, and Description sections Go
  • Deleted Application Hints sectionGo
  • Changed Pin Configuration and Functions title and sectionGo
  • Changed title, condition statement, and curve titles and added curves for new chip in Typical Characteristics sectionGo
  • Changed Functional Block Diagram figureGo
  • Added Output Enable sectionGo
  • Added Dropout Voltage sectionGo
  • Added Current Limit sectionGo
  • Added Undervoltage Lockout (UVLO) sectionGo
  • Added Output Pulldown sectionGo
  • Added Thermal Shutdown sectionGo
  • Added Device Functional Mode Comparison sectionGo
  • Added External Feedback Resistors sectionGo
  • Added Recommended Capacitor Types sectionGo
  • Added Input and Output Capacitor Requirements sectionGo
  • Added Feed-Forward Capacitor (CFF) sectionGo
  • Added Reverse Current sectionGo
  • Added Power Dissipation (PD) sectionGo
  • Added Estimating Junction Temperature sectionGo
  • Added Setting VOUT For the LP2980-ADJ LDO sectionGo
  • Added Device Nomenclature sectionGo

Changes from Revision D (April 2013) to Revision E (April 2013)

  • Changed layout of National Data Sheet to TI formatGo