SNVS321O January   2005  – December 2015 LP38691 , LP38691-Q1 , LP38693 , LP38693-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LP38691 and LP38693
    3. 6.3 ESD Ratings: LP38691-Q1 and LP38693-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Overload Protection (TSD)
      3. 7.3.3 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Voltage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 No-Load Stability
        6. 8.2.2.6 Capacitor Characteristics
        7. 8.2.2.7 RFI/EMI Susceptibility
        8. 8.2.2.8 Output Noise
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from N Revision (March 2015) to O Revision

  • Added top navigator icon for TI Designs Go
  • Added Caution note to Foldback Current Limiting subsection Go

Changes from M Revision (February 2015) to N Revision

  • Added "Cout = xx pF" to "Cout = µF" for Figures 4 through 6 in Typical CharacteristicsGo

Changes from L Revision (December 2014) to M Revision

  • Changed wording of Description and added one item to Features; update Vin, Vout and Ven pin names to IN, OUT, and EN in text and graphics Go
  • Added top navigator icon for TI Designs Go
  • Changed "PFM" to 'TO-252" Go
  • Changed Handling Ratings to ESD Ratings format Go

Changes from K Revision (April 2013) to L Revision

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; update thermal valuesGo

Changes from J Revision (April 2013) to K Revision

  • Changed layout of National Data Sheet to TI formatGo