SNVS323I December   2004  – February 2016 LP38690-ADJ , LP38692-ADJ

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin (LP38692-ADJ Only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Voltage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting The Output Voltage
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 Selecting A Capacitor
            1. 8.2.2.2.3.1 Ceramic
            2. 8.2.2.2.3.2 Tantalum
        3. 8.2.2.3 RFI/EMI Susceptibility
        4. 8.2.2.4 Output Noise
        5. 8.2.2.5 Power Dissipation
        6. 8.2.2.6 Estimating Junction Temperature
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from H Revision (April 2013) to I Revision

  • Added top navigator icon for TI Design Go
  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed pin names from "Vin", "Vout" and "Ven" to "IN", "OUT", and "EN"Go
  • Changed language of note 3 to Abs Max table Go
  • Added Caution note to Foldback Current Limiting subsection Go
  • Deleted paragraph beginning "For the LP38690-ADJ and LP38692-ADJ in the NGG0006A 6-Lead WSON package..." and table following - information out of dateGo

Changes from G Revision (December 2010) to H Revision

  • Changed layout of National Data Sheet to TI formatGo