SNVS056J May   2000  – June 2015 LP3961 , LP3964

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Short-Circuit Protection
      2. 7.3.2 ERROR Flag Operation
      3. 7.3.3 SENSE Pin
      4. 7.3.4 Dropout Voltage
      5. 7.3.5 Reverse Current Path
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VOUT(TARGET) + 0.35 V ≤ VIN ≤ 7 V
      2. 7.4.2 Operation With Shutdown (SD) Pin Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Input Capacitor
          2. 8.2.2.1.2 Output Capacitor
        2. 8.2.2.2 Selecting a Capacitor
        3. 8.2.2.3 Capacitor Characteristics
          1. 8.2.2.3.1 Ceramic
          2. 8.2.2.3.2 Tantalum
          3. 8.2.2.3.3 Aluminum
        4. 8.2.2.4 RFI and EMI Susceptibility
        5. 8.2.2.5 Output Adjustment
        6. 8.2.2.6 Turnon Characteristics for Output Voltages Programmed to 2.0 V or Below
        7. 8.2.2.7 Output Noise
        8. 8.2.2.8 Shutdown Operation
        9. 8.2.2.9 Maximum Output Current Capability
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heatsinking TO-220 Packages
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from I Revision (December 2014) to J Revision

  • Changed pin names to conform to TI nomenclature (VOUT to OUT, VIN to IN)Go
  • Changed "I" to "O" to correct I/O type for ERROR flag Go
  • Deleted Lead temperature row - info in POA Go
  • Deleted heatsinking sections re TO-263 and SOT-223 packages; not consistent with updated thermal metrics Go

Changes from H Revision (April 2013) to I Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from G Revision (April 2013) to H Revision